AMD Xilinx
XC6VHX255T-2FFG1155I
XC6VHX255T-2FFG1155I ECAD Model
XC6VHX255T-2FFG1155I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 440 | |
| Number of Outputs | 440 | |
| Number of Logic Cells | 253440 | |
| Combinatorial Delay of a CLB-Max | 4.29 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.286 GHz | |
| Power Supplies | 1,1.2/2.5 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B1155 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1155 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1155,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 35 X 35 MM, LEAD FREE, FBGA-1155 | |
| Pin Count | 1155 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC6VHX255T-2FFG1155I Datasheet Download
XC6VHX255T-2FFG1155I Overview
The XC6VHX255T-2FFG1155I chip model is a powerful tool for modern industries. It has a wide range of applications in various industries, such as communications, networks, and intelligent systems. It is designed to provide the best performance and reliability for its users.
The XC6VHX255T-2FFG1155I chip model offers a number of advantages over other chip models. It is designed to provide high-speed data processing, allowing for faster and smoother communication between networks and devices. It also has a high level of integration, allowing for more efficient and accurate communication between different systems. Additionally, the chip model offers a wide range of features that make it suitable for a variety of applications.
The XC6VHX255T-2FFG1155I chip model is expected to be in high demand in the future. Its high-speed data processing capabilities, efficient integration, and wide range of features make it an ideal choice for many industries. In addition, its compatibility with advanced communication systems makes it suitable for use in the future.
The XC6VHX255T-2FFG1155I chip model has the potential to be upgraded in the future. It is designed for scalability, allowing for the addition of new features and functions as needed. This makes it ideal for use in advanced communication systems and networks. Additionally, it is capable of being used in the era of fully intelligent systems, allowing for advanced network capabilities and intelligent scenarios.
The XC6VHX255T-2FFG1155I chip model is an ideal choice for a variety of applications. It is designed for high-speed data processing, efficient integration, and a wide range of features. Additionally, it is capable of being used in the era of fully intelligent systems, allowing for advanced network capabilities and intelligent scenarios. As such, it is expected to be in high demand in the future and is a great tool for modern industries.
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5,352 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $3,467.3897 | $3,467.3897 |
| 10+ | $3,430.1059 | $34,301.0592 |
| 100+ | $3,243.6871 | $324,368.7120 |
| 1000+ | $3,057.2683 | $1,528,634.1600 |
| 10000+ | $2,796.2820 | $2,796,282.0000 |
| The price is for reference only, please refer to the actual quotation! | ||