AMD Xilinx
XC6VHX255T-1FFG1155C
XC6VHX255T-1FFG1155C ECAD Model
XC6VHX255T-1FFG1155C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 440 | |
| Number of Outputs | 440 | |
| Number of Logic Cells | 253440 | |
| Combinatorial Delay of a CLB-Max | 5.08 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.098 GHz | |
| Power Supplies | 1,1.2/2.5 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B1155 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1155 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1155,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 35 X 35 MM, LEAD FREE, FBGA-1155 | |
| Pin Count | 1155 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC6VHX255T-1FFG1155C Datasheet Download
XC6VHX255T-1FFG1155C Overview
The XC6VHX255T-1FFG1155C chip model is a revolutionary new model that has the potential to revolutionize the technology industry. It is a highly advanced processor that is designed to meet the demands of modern networks and intelligent scenarios. It is a powerful and reliable chip model that is capable of handling a variety of tasks and can be used in a variety of applications.
The XC6VHX255T-1FFG1155C chip model is designed to provide excellent performance and reliability. It is designed to handle a wide range of tasks, from basic networking to complex intelligent scenarios. It is capable of handling large amounts of data and is capable of handling multiple tasks simultaneously. Its design also allows for efficient power consumption and low latency.
The XC6VHX255T-1FFG1155C chip model is designed to be used in a variety of applications. It can be used in a variety of networks, including wireless networks, as well as in intelligent scenarios. It can also be used to develop new applications and technologies. It is designed to be compatible with existing technologies, as well as new technologies that are being developed.
The XC6VHX255T-1FFG1155C chip model is designed to be used in the future of fully intelligent systems. It is designed to be able to handle large amounts of data and can be used to develop new applications and technologies. It is also designed to be compatible with existing technologies and can be used to develop new technologies that are being developed.
The XC6VHX255T-1FFG1155C chip model is designed to meet the demands of modern networks and intelligent scenarios. It is designed to be reliable and efficient and is capable of handling large amounts of data. It is also designed to be compatible with existing technologies and can be used to develop new technologies that are being developed.
When considering the future of the XC6VHX255T-1FFG1155C chip model, it is important to look at the industry trends and the future development of related industries. It is also important to consider the application environment and what specific technologies are needed. It is important to look at the product description and design requirements of the chip model, as well as actual case studies and precautions. By doing this, it is possible to determine the possible future applications of the chip model and whether it is possible to be used in the era of fully intelligent systems.
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2,522 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,981.2348 | $1,981.2348 |
| 10+ | $1,959.9312 | $19,599.3120 |
| 100+ | $1,853.4132 | $185,341.3200 |
| 1000+ | $1,746.8952 | $873,447.6000 |
| 10000+ | $1,597.7700 | $1,597,770.0000 |
| The price is for reference only, please refer to the actual quotation! | ||