XC4VLX200-12FFG1513C
XC4VLX200-12FFG1513C
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rohs

AMD Xilinx

XC4VLX200-12FFG1513C


XC4VLX200-12FFG1513C
F20-XC4VLX200-12FFG1513C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, LEAD FREE, FBGA-1513
LEAD FREE, FBGA-1513

XC4VLX200-12FFG1513C ECAD Model


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XC4VLX200-12FFG1513C Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 1.2 V
Number of Inputs 960
Number of Outputs 960
Number of Logic Cells 200448
Number of CLBs 22272
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 22272 CLBS
Clock Frequency-Max 1.205 GHz
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
JESD-30 Code S-PBGA-B1513
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1513
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1513,39X39,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 40 mm
Length 40 mm
Seated Height-Max 3.25 mm
Ihs Manufacturer XILINX INC
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01
Part Package Code BGA
Package Description LEAD FREE, FBGA-1513
Pin Count 1513

XC4VLX200-12FFG1513C Datasheet Download


XC4VLX200-12FFG1513C Overview



The XC4VLX200-12FFG1513C chip model is a high-performance, low-power FPGA designed for a wide range of applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language. The original design intention of the XC4VLX200-12FFG1513C chip model was to provide a powerful and reliable platform for applications that require high performance and low power consumption. The chip model also has the potential to be upgraded in the future to meet the needs of advanced communication systems.


The XC4VLX200-12FFG1513C chip model is equipped with a variety of features that make it suitable for a wide range of applications. It has a low power consumption of only 1.2W, and a fast speed of up to 200MHz. It also has a high-density logic architecture with up to 12.5 million logic elements, and a wide range of I/O capabilities, including LVDS, SSTL2, and SSTL3. Additionally, the chip model is equipped with advanced memory options, including DDR2 and DDR3.


The product description of the XC4VLX200-12FFG1513C chip model includes detailed specifications, such as the number of logic elements, power consumption, speed, and I/O capabilities. Additionally, the product description provides a list of the design and development tools that are compatible with the chip model. It also includes a list of the available reference designs, as well as the necessary documentation and support resources.


To ensure the successful implementation of the XC4VLX200-12FFG1513C chip model, there are several key design considerations. The design should consider the power consumption, speed, and memory requirements of the application. Additionally, the design should ensure that the I/O capabilities are compatible with the application. Furthermore, the design should consider the available reference designs and development tools to ensure the successful implementation of the chip model.


To demonstrate the capabilities of the XC4VLX200-12FFG1513C chip model, there are several case studies available. These case studies provide detailed information about the design and implementation of the chip model in various applications. Additionally, these case studies provide information about the performance of the chip model in various applications.


In conclusion, the XC4VLX200-12FFG1513C chip model is a powerful and reliable platform for applications that require high performance and low power consumption. It is suitable for a wide range of applications, including high-performance digital signal processing, embedded processing, and image processing. Additionally, the chip model has the potential to be upgraded in the future to meet the needs of advanced communication systems. The product description and design considerations of the chip model are available, as well as several case studies that demonstrate its capabilities.



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