
AMD Xilinx
XC4VLX200-12FFG1513C
XC4VLX200-12FFG1513C ECAD Model
XC4VLX200-12FFG1513C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1.2 V | |
Number of Inputs | 960 | |
Number of Outputs | 960 | |
Number of Logic Cells | 200448 | |
Number of CLBs | 22272 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 22272 CLBS | |
Clock Frequency-Max | 1.205 GHz | |
Supply Voltage-Max | 1.26 V | |
Supply Voltage-Min | 1.14 V | |
JESD-30 Code | S-PBGA-B1513 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1513 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1513,39X39,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 40 mm | |
Length | 40 mm | |
Seated Height-Max | 3.25 mm | |
Ihs Manufacturer | XILINX INC | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 | |
Part Package Code | BGA | |
Package Description | LEAD FREE, FBGA-1513 | |
Pin Count | 1513 |
XC4VLX200-12FFG1513C Datasheet Download
XC4VLX200-12FFG1513C Overview
The XC4VLX200-12FFG1513C chip model is a high-performance, low-power FPGA designed for a wide range of applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language. The original design intention of the XC4VLX200-12FFG1513C chip model was to provide a powerful and reliable platform for applications that require high performance and low power consumption. The chip model also has the potential to be upgraded in the future to meet the needs of advanced communication systems.
The XC4VLX200-12FFG1513C chip model is equipped with a variety of features that make it suitable for a wide range of applications. It has a low power consumption of only 1.2W, and a fast speed of up to 200MHz. It also has a high-density logic architecture with up to 12.5 million logic elements, and a wide range of I/O capabilities, including LVDS, SSTL2, and SSTL3. Additionally, the chip model is equipped with advanced memory options, including DDR2 and DDR3.
The product description of the XC4VLX200-12FFG1513C chip model includes detailed specifications, such as the number of logic elements, power consumption, speed, and I/O capabilities. Additionally, the product description provides a list of the design and development tools that are compatible with the chip model. It also includes a list of the available reference designs, as well as the necessary documentation and support resources.
To ensure the successful implementation of the XC4VLX200-12FFG1513C chip model, there are several key design considerations. The design should consider the power consumption, speed, and memory requirements of the application. Additionally, the design should ensure that the I/O capabilities are compatible with the application. Furthermore, the design should consider the available reference designs and development tools to ensure the successful implementation of the chip model.
To demonstrate the capabilities of the XC4VLX200-12FFG1513C chip model, there are several case studies available. These case studies provide detailed information about the design and implementation of the chip model in various applications. Additionally, these case studies provide information about the performance of the chip model in various applications.
In conclusion, the XC4VLX200-12FFG1513C chip model is a powerful and reliable platform for applications that require high performance and low power consumption. It is suitable for a wide range of applications, including high-performance digital signal processing, embedded processing, and image processing. Additionally, the chip model has the potential to be upgraded in the future to meet the needs of advanced communication systems. The product description and design considerations of the chip model are available, as well as several case studies that demonstrate its capabilities.
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QTY | Unit Price | Ext Price |
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