AMD Xilinx
XC4VLX200-10FFG1513C
XC4VLX200-10FFG1513C ECAD Model
XC4VLX200-10FFG1513C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 960 | |
| Number of Outputs | 960 | |
| Number of Logic Cells | 200448 | |
| Number of CLBs | 22272 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 22272 CLBS | |
| Clock Frequency-Max | 1.028 GHz | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PBGA-B1513 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1513 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1513,39X39,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| Length | 40 mm | |
| Seated Height-Max | 3.25 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LEAD FREE, FBGA-1513 | |
| Pin Count | 1513 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.7.A | |
| HTS Code | 8542.39.00.01 |
XC4VLX200-10FFG1513C Datasheet Download
XC4VLX200-10FFG1513C Overview
The XC4VLX200-10FFG1513C chip model is a versatile, high-performance integrated circuit (IC) that is suitable for a variety of applications in the field of modern networking. It is a powerful tool for developing and deploying intelligent systems and can be used to create a wide range of intelligent scenarios.
The XC4VLX200-10FFG1513C chip model is designed to provide high-speed data transmission and processing capabilities, allowing for rapid and efficient communication between networked devices. It features a wide range of features and specifications that make it ideal for use in large-scale networks. It is capable of supporting a variety of network protocols, including Ethernet, Wi-Fi, and cellular networks. Additionally, the chip model is designed to provide high-level security measures, such as encryption, authentication, and access control, to ensure the safety and integrity of data.
The XC4VLX200-10FFG1513C chip model is also well-suited for use in the development and popularization of future intelligent robots. It is capable of providing the necessary hardware and software components for the development of advanced artificial intelligence (AI) systems. Additionally, the chip model can be used to create a range of intelligent scenarios and applications, such as autonomous navigation, facial recognition, and natural language processing.
In order to effectively use the XC4VLX200-10FFG1513C chip model, it is necessary to have a thorough understanding of the product specifications and design requirements. Additionally, it is important to be familiar with the best practices and precautions in order to ensure the safety and reliability of the system. To this end, it is recommended that users consult the product manual and review actual case studies to gain a better understanding of the model’s capabilities and limitations.
In conclusion, the XC4VLX200-10FFG1513C chip model is a powerful and versatile tool for developing and deploying intelligent systems. It is capable of providing the necessary hardware and software components for the development of advanced AI systems, as well as a range of intelligent scenarios and applications. In order to use the model effectively, it is important to have a thorough understanding of the product specifications and design requirements, as well as best practices and precautions.
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|---|---|---|
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