
AMD Xilinx
XC4VLX160-11FFG1513I
XC4VLX160-11FFG1513I ECAD Model
XC4VLX160-11FFG1513I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1.2 V | |
Number of Inputs | 960 | |
Number of Outputs | 960 | |
Number of Logic Cells | 152064 | |
Number of CLBs | 16896 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 16896 CLBS | |
Clock Frequency-Max | 1.205 GHz | |
Supply Voltage-Max | 1.26 V | |
Supply Voltage-Min | 1.14 V | |
JESD-30 Code | S-PBGA-B1513 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1513 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1513,39X39,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 40 mm | |
Length | 40 mm | |
Seated Height-Max | 3.25 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | LEAD FREE, FBGA-1513 | |
Pin Count | 1513 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A001.A.7.A | |
HTS Code | 8542.39.00.01 |
XC4VLX160-11FFG1513I Datasheet Download
XC4VLX160-11FFG1513I Overview
The XC4VLX160-11FFG1513I chip model is a powerful tool for the development of modern technology. It is a high-performance, low-power Field Programmable Gate Array (FPGA) that is designed to be used in a variety of applications. The chip model has a wide range of capabilities, including high-speed data processing, high-speed signal processing, and high-speed memory access. Its flexible architecture also allows for the integration of various technologies, such as analog and digital signal processing, high-speed communication protocols, and high-speed data acquisition.
The industry trends of the XC4VLX160-11FFG1513I chip model are constantly evolving. As the demand for more advanced technology increases, the chip model is being used in more and more applications. For example, the chip model is being used in the development of high-speed communication networks, intelligent robots, and autonomous vehicles. The chip model is also being used in the development of advanced AI and machine learning algorithms.
The application environment of the XC4VLX160-11FFG1513I chip model also requires the support of new technologies. For example, the chip model can be used to develop and popularize future intelligent robots, and it requires the support of the latest technologies such as artificial intelligence and machine learning. The chip model also requires the support of high-speed communication protocols, such as 5G and Wi-Fi 6. Furthermore, the chip model can be used to develop and deploy advanced AI algorithms and machine learning algorithms.
The XC4VLX160-11FFG1513I chip model can be used in a variety of scenarios, such as in the development of autonomous vehicles, intelligent robots, and high-speed communication networks. It can also be used in the development and deployment of advanced AI and machine learning algorithms. To use the chip model effectively, it requires the support of highly skilled technical personnel, such as software engineers and data scientists.
In conclusion, the XC4VLX160-11FFG1513I chip model is a powerful tool for the development of modern technology. Its flexible architecture and wide range of capabilities make it suitable for a variety of applications. The industry trends of the chip model and the application environment require the support of new technologies, such as artificial intelligence and machine learning. Furthermore, the chip model requires the support of highly skilled technical personnel to use it effectively.
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