XC3S500E-4FGG320CS1
XC3S500E-4FGG320CS1
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rohs

AMD Xilinx

XC3S500E-4FGG320CS1


XC3S500E-4FGG320CS1
F20-XC3S500E-4FGG320CS1
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, BGA, BGA320,18X18,40
BGA, BGA320,18X18,40

XC3S500E-4FGG320CS1 ECAD Model


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XC3S500E-4FGG320CS1 Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.2 V
Number of Inputs 232
Number of Outputs 176
Number of Logic Cells 10476
Number of Equivalent Gates 500000
Number of CLBs 1164
Combinatorial Delay of a CLB-Max 760 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 1164 CLBS, 500000 GATES
Clock Frequency-Max 572 MHz
Power Supplies 1.2,1.2/3.3,2.5 V
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
JESD-30 Code S-PBGA-B320
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 320
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA320,18X18,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 19 mm
Length 19 mm
Seated Height-Max 2 mm
Ihs Manufacturer XILINX INC
Package Description BGA, BGA320,18X18,40
Reach Compliance Code unknown
HTS Code 8542.39.00.01

XC3S500E-4FGG320CS1 Datasheet Download


XC3S500E-4FGG320CS1 Overview



The XC3S500E-4FGG320CS1 chip model is a popular choice for many industries. It is a field programmable gate array (FPGA) that provides a high-performance, low-power solution for a wide range of applications. It offers a variety of features, such as high-speed logic, embedded memory and DSP blocks, and a wide range of I/O and communication protocols. This makes it suitable for a variety of applications, from consumer electronics to industrial automation.


The XC3S500E-4FGG320CS1 chip model is designed to be highly reliable and efficient. It is designed to reduce power consumption while still providing high performance. This makes it ideal for applications that require low power consumption, such as mobile devices, wearables, and other battery-powered devices. Furthermore, its low-cost, low-power design makes it an ideal choice for cost-sensitive applications.


The XC3S500E-4FGG320CS1 chip model is also designed to be highly scalable. It can be used in a variety of network architectures, including wired, wireless, and mesh networks. It can also be used in a variety of intelligent scenarios, such as machine learning, natural language processing, and computer vision. This makes it ideal for applications that require complex algorithms and data processing.


Looking to the future, the XC3S500E-4FGG320CS1 chip model is expected to remain in high demand. It is likely to become even more popular as new technologies emerge and the demand for low-power, high-performance solutions increases. It is also likely to be used in the era of fully intelligent systems, as it can provide the computing power and flexibility needed for complex algorithms and data processing.


In conclusion, the XC3S500E-4FGG320CS1 chip model is an excellent choice for a variety of applications. It is highly reliable and efficient, and is designed to reduce power consumption while still providing high performance. It is also highly scalable, making it an ideal choice for a variety of networks and intelligent scenarios. Finally, its popularity is expected to remain high in the future, as new technologies emerge and the demand for low-power, high-performance solutions increases.



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Unit Price: $78.4274
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Pricing (USD)

QTY Unit Price Ext Price
1+ $72.9375 $72.9375
10+ $72.1532 $721.5321
100+ $68.2318 $6,823.1838
1000+ $64.3105 $32,155.2340
10000+ $58.8206 $58,820.5500
The price is for reference only, please refer to the actual quotation!

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