
AMD Xilinx
XC3S1600E-4FGG320CS1
XC3S1600E-4FGG320CS1 ECAD Model
XC3S1600E-4FGG320CS1 Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.2 V | |
Number of Inputs | 250 | |
Number of Outputs | 194 | |
Number of Logic Cells | 33192 | |
Number of Equivalent Gates | 1600000 | |
Number of CLBs | 3688 | |
Combinatorial Delay of a CLB-Max | 760 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 3688 CLBS, 1600000 GATES | |
Clock Frequency-Max | 572 MHz | |
Power Supplies | 1.2,1.2/3.3,2.5 V | |
Supply Voltage-Max | 1.26 V | |
Supply Voltage-Min | 1.14 V | |
JESD-30 Code | S-PBGA-B320 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 260 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 320 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA320,18X18,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 19 mm | |
Length | 19 mm | |
Seated Height-Max | 2 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | BGA, BGA320,18X18,40 | |
Pin Count | 320 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 |
XC3S1600E-4FGG320CS1 Datasheet Download
XC3S1600E-4FGG320CS1 Overview
The XC3S1600E-4FGG320CS1 chip model is a powerful and versatile tool for network and intelligent systems applications. It is a field programmable gate array (FPGA) device that is optimized for high performance and low power consumption. The FPGA technology is ideal for applications that require flexibility and scalability, as it can be easily reprogrammed to accommodate changes in design requirements.
The XC3S1600E-4FGG320CS1 chip model offers a wide range of features and capabilities, including support for various communication protocols, high-speed data transfer, and advanced signal processing. It is also designed to be highly reliable and secure, making it suitable for use in mission-critical applications. Its on-chip memory and embedded processor make it suitable for use in a wide range of applications, including industrial automation, robotics, and medical systems.
In terms of industry trends, the XC3S1600E-4FGG320CS1 chip model is expected to be used in a wide range of applications in the near future. It is likely to be applied in intelligent scenarios such as autonomous vehicles, smart homes, and smart cities. It is also expected to be used in the era of fully intelligent systems, as its advanced features and capabilities make it suitable for such applications.
The product description and design requirements of the XC3S1600E-4FGG320CS1 chip model should be carefully studied in order to ensure that it meets the application requirements. It is important to consider the performance, power consumption, and cost of the chip model, as well as the size of the device, its connectivity, and its compatibility with other components. Additionally, the design should also consider the security and reliability of the device.
Finally, it is important to consider actual case studies and precautions when using the XC3S1600E-4FGG320CS1 chip model. This will help to ensure that the device is used in an optimal manner and that any potential risks are minimized. For example, it is important to consider the potential for electromagnetic interference, thermal issues, and other environmental factors that could affect the performance of the chip. Additionally, it is important to consider the security measures that need to be taken in order to protect the device from malicious attacks.
Overall, the XC3S1600E-4FGG320CS1 chip model is a powerful and versatile tool for network and intelligent systems applications. It is expected to be used in a wide range of applications in the near future, and its advanced features and capabilities make it suitable for use in the era of fully intelligent systems. It is important to consider the product description and design requirements, as well as actual case studies and precautions, in order to ensure that the device is used in an optimal manner.
You May Also Be Interested In
1,438 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
No reference price found. |