XC3S1600E-4FGG320CS1
XC3S1600E-4FGG320CS1
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rohs

AMD Xilinx

XC3S1600E-4FGG320CS1


XC3S1600E-4FGG320CS1
F20-XC3S1600E-4FGG320CS1
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, BGA, BGA320,18X18,40
BGA, BGA320,18X18,40

XC3S1600E-4FGG320CS1 ECAD Model


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XC3S1600E-4FGG320CS1 Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.2 V
Number of Inputs 250
Number of Outputs 194
Number of Logic Cells 33192
Number of Equivalent Gates 1600000
Number of CLBs 3688
Combinatorial Delay of a CLB-Max 760 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 3688 CLBS, 1600000 GATES
Clock Frequency-Max 572 MHz
Power Supplies 1.2,1.2/3.3,2.5 V
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
JESD-30 Code S-PBGA-B320
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 320
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA320,18X18,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 19 mm
Length 19 mm
Seated Height-Max 2 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description BGA, BGA320,18X18,40
Pin Count 320
Reach Compliance Code unknown
HTS Code 8542.39.00.01

XC3S1600E-4FGG320CS1 Datasheet Download


XC3S1600E-4FGG320CS1 Overview



The XC3S1600E-4FGG320CS1 chip model is a powerful and versatile tool for network and intelligent systems applications. It is a field programmable gate array (FPGA) device that is optimized for high performance and low power consumption. The FPGA technology is ideal for applications that require flexibility and scalability, as it can be easily reprogrammed to accommodate changes in design requirements.


The XC3S1600E-4FGG320CS1 chip model offers a wide range of features and capabilities, including support for various communication protocols, high-speed data transfer, and advanced signal processing. It is also designed to be highly reliable and secure, making it suitable for use in mission-critical applications. Its on-chip memory and embedded processor make it suitable for use in a wide range of applications, including industrial automation, robotics, and medical systems.


In terms of industry trends, the XC3S1600E-4FGG320CS1 chip model is expected to be used in a wide range of applications in the near future. It is likely to be applied in intelligent scenarios such as autonomous vehicles, smart homes, and smart cities. It is also expected to be used in the era of fully intelligent systems, as its advanced features and capabilities make it suitable for such applications.


The product description and design requirements of the XC3S1600E-4FGG320CS1 chip model should be carefully studied in order to ensure that it meets the application requirements. It is important to consider the performance, power consumption, and cost of the chip model, as well as the size of the device, its connectivity, and its compatibility with other components. Additionally, the design should also consider the security and reliability of the device.


Finally, it is important to consider actual case studies and precautions when using the XC3S1600E-4FGG320CS1 chip model. This will help to ensure that the device is used in an optimal manner and that any potential risks are minimized. For example, it is important to consider the potential for electromagnetic interference, thermal issues, and other environmental factors that could affect the performance of the chip. Additionally, it is important to consider the security measures that need to be taken in order to protect the device from malicious attacks.


Overall, the XC3S1600E-4FGG320CS1 chip model is a powerful and versatile tool for network and intelligent systems applications. It is expected to be used in a wide range of applications in the near future, and its advanced features and capabilities make it suitable for use in the era of fully intelligent systems. It is important to consider the product description and design requirements, as well as actual case studies and precautions, in order to ensure that the device is used in an optimal manner.



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