AMD Xilinx
XC3S500E-4FG320CS1
XC3S500E-4FG320CS1 ECAD Model
XC3S500E-4FG320CS1 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 232 | |
| Number of Outputs | 176 | |
| Number of Logic Cells | 10476 | |
| Number of Equivalent Gates | 500000 | |
| Number of CLBs | 1164 | |
| Combinatorial Delay of a CLB-Max | 760 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1164 CLBS, 500000 GATES | |
| Clock Frequency-Max | 572 MHz | |
| Power Supplies | 1.2,1.2/3.3,2.5 V | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PBGA-B320 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 320 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA320,18X18,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 19 mm | |
| Length | 19 mm | |
| Seated Height-Max | 2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA320,18X18,40 | |
| Pin Count | 320 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC3S500E-4FG320CS1 Datasheet Download
XC3S500E-4FG320CS1 Overview
The XC3S500E-4FG320CS1 chip model is a powerful and versatile device that is suitable for a variety of applications, such as high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with HDL language, which is a powerful and versatile programming language.
The XC3S500E-4FG320CS1 chip model offers a number of advantages, such as its high speed, low power consumption, and small size. It is also highly reliable and can be used in a wide range of applications. This makes it a great choice for those looking for a reliable and efficient chip model.
The demand for the XC3S500E-4FG320CS1 chip model is expected to increase in the future, as more and more industries are looking for reliable and efficient solutions. This is due to the fact that the chip model offers a number of advantages, such as its high speed, low power consumption, and small size. As such, the chip model is expected to remain in high demand in the future.
In terms of the application environment, the XC3S500E-4FG320CS1 chip model may require the support of new technologies in order to remain competitive. For example, new technologies such as artificial intelligence and machine learning may be needed in order to take full advantage of the chip model’s capabilities.
Overall, the XC3S500E-4FG320CS1 chip model is a powerful and versatile device that is suitable for a variety of applications. It offers a number of advantages, such as its high speed, low power consumption, and small size. As such, the demand for the chip model is expected to remain strong in the future, and it may require the support of new technologies in order to remain competitive.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||