AMD Xilinx
XC3064A-7PP132I
XC3064A-7PP132I ECAD Model
XC3064A-7PP132I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 110 | |
| Number of Outputs | 110 | |
| Number of Logic Cells | 224 | |
| Number of Equivalent Gates | 3500 | |
| Number of CLBs | 224 | |
| Combinatorial Delay of a CLB-Max | 5.1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 224 CLBS, 3500 GATES | |
| Additional Feature | MAX USABLE 4500 LOGIC GATES | |
| Clock Frequency-Max | 113 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | S-PPGA-P132 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 1 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Number of Terminals | 132 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HPGA | |
| Package Equivalence Code | PGA132,14X14 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Surface Mount | NO | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 37.084 mm | |
| Length | 37.084 mm | |
| Seated Height-Max | 4.191 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | PGA | |
| Package Description | HPGA, PGA132,14X14 | |
| Pin Count | 132 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC3064A-7PP132I Datasheet Download
XC3064A-7PP132I Overview
The XC3064A-7PP132I chip model is a powerful and versatile tool for digital signal processing, embedded processing, and image processing. This chip model is designed to be used with a hardware description language (HDL), which allows for the development of complex and sophisticated systems. The XC3064A-7PP132I chip model offers a number of advantages, including high performance, low power consumption, and scalability. Furthermore, the XC3064A-7PP132I chip model is expected to be in high demand in the near future, as the demand for high-performance embedded systems continues to rise.
The XC3064A-7PP132I chip model can be used to develop and popularize intelligent robots in the future. This chip model is capable of providing the necessary processing power to enable robots to perform complex tasks. In order to use the XC3064A-7PP132I chip model effectively, technical talents with knowledge of HDL language are necessary. These technical talents should have a thorough understanding of the chip model, its capabilities, and the HDL language. Furthermore, these technical talents should also have experience in developing embedded systems and robots.
In conclusion, the XC3064A-7PP132I chip model is a powerful and versatile tool for digital signal processing, embedded processing, and image processing. This chip model is expected to be in high demand in the near future, and can be used to develop and popularize intelligent robots. In order to use the XC3064A-7PP132I chip model effectively, technical talents with knowledge of HDL language are necessary.
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