AMD Xilinx
XC3064A-6PP132C
XC3064A-6PP132C ECAD Model
XC3064A-6PP132C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 110 | |
| Number of Outputs | 110 | |
| Number of Logic Cells | 224 | |
| Number of Equivalent Gates | 3500 | |
| Number of CLBs | 224 | |
| Combinatorial Delay of a CLB-Max | 4.1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 224 CLBS, 3500 GATES | |
| Additional Feature | MAX USABLE 4500 LOGIC GATES | |
| Clock Frequency-Max | 135 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PPGA-P132 | |
| Qualification Status | Not Qualified | |
| Moisture Sensitivity Level | 1 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 132 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HPGA | |
| Package Equivalence Code | PGA132,14X14 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Surface Mount | NO | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 37.084 mm | |
| Length | 37.084 mm | |
| Seated Height-Max | 4.191 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | PGA | |
| Package Description | HPGA, PGA132,14X14 | |
| Pin Count | 132 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC3064A-6PP132C Datasheet Download
XC3064A-6PP132C Overview
The chip model XC3064A-6PP132C is a cutting-edge chip model developed by Xilinx, a leading semiconductor company. It is designed to meet the needs of high-performance embedded systems, such as industrial control systems, automotive systems, and communication systems. The chip model is equipped with a 32-bit RISC processor core, a high-speed memory interface, a powerful programmable logic array, and a variety of peripherals.
The XC3064A-6PP132C is designed to be highly reliable and efficient, with a wide range of features that make it suitable for use in a variety of applications. For example, the chip model is capable of supporting advanced communication systems, such as 5G and Wi-Fi 6. It is also designed to be highly scalable, allowing for future upgrades and expansions. With its advanced features, the XC3064A-6PP132C is suitable for use in a variety of intelligent scenarios, such as artificial intelligence, machine learning, and robotics.
The XC3064A-6PP132C is also designed to be highly efficient, with low power consumption and high performance. This makes it suitable for use in a variety of networks, such as the Internet of Things (IoT) and the Industrial Internet of Things (IIoT). In addition, the chip model is designed to be compatible with a variety of new technologies, such as 5G, Wi-Fi 6, and the latest versions of Bluetooth and NFC. This makes it suitable for use in the era of fully intelligent systems, where it can be used to enable a range of advanced applications.
Overall, the XC3064A-6PP132C is a highly advanced chip model that is designed to meet the needs of high-performance embedded systems. It is highly reliable, efficient, and scalable, making it suitable for use in a variety of applications and intelligent scenarios. It is also designed to be compatible with a variety of new technologies, making it suitable for use in the era of fully intelligent systems. As such, the XC3064A-6PP132C is an ideal choice for those looking to take advantage of the latest advancements in chip technology.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||