AMD Xilinx
XC3064A-7PG132C
XC3064A-7PG132C ECAD Model
XC3064A-7PG132C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 110 | |
| Number of Outputs | 110 | |
| Number of Logic Cells | 224 | |
| Number of Equivalent Gates | 3500 | |
| Number of CLBs | 224 | |
| Combinatorial Delay of a CLB-Max | 5.1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 224 CLBS, 3500 GATES | |
| Additional Feature | MAX USABLE 4500 LOGIC GATES | |
| Clock Frequency-Max | 113 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-CPGA-P132 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 132 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | HPGA | |
| Package Equivalence Code | PGA132,14X14 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Surface Mount | NO | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 37.084 mm | |
| Length | 37.084 mm | |
| Seated Height-Max | 4.318 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | PGA | |
| Package Description | HPGA, PGA132,14X14 | |
| Pin Count | 132 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC3064A-7PG132C Datasheet Download
XC3064A-7PG132C Overview
The chip model XC3064A-7PG132C is a powerful and innovative technology developed by Xilinx Corporation. It is a field programmable gate array (FPGA) that offers a variety of features, such as high-speed transceivers, on-chip memory, and high-performance logic. As a result, this chip model has become a popular choice for a wide range of applications, including networking, embedded systems, and digital signal processing.
The industry trends of the chip model XC3064A-7PG132C are constantly evolving and the future development of related industries is likely to be heavily influenced by the model. It is possible that the application environment may require the support of new technologies, such as artificial intelligence, machine learning, and edge computing. It is also possible that the chip model may be used to develop and popularize future intelligent robots, and that new technical talents may be needed to use the model effectively.
The chip model XC3064A-7PG132C can also be used in networks and can be applied to a wide range of intelligent scenarios. It is possible that the model can be used in the era of fully intelligent systems, as it offers features such as high-speed transceivers, on-chip memory, and high-performance logic. In addition, the model can be used to develop and popularize future intelligent robots, and new technical talents may be needed to use the model effectively.
Overall, the chip model XC3064A-7PG132C is a powerful and innovative technology that offers a variety of features and can be used in a wide range of applications. As the industry trends of the model are constantly evolving, the future development of related industries is likely to be heavily influenced by the model. It is possible that the application environment may require the support of new technologies, such as artificial intelligence, machine learning, and edge computing. In addition, the model can be used to develop and popularize future intelligent robots, and new technical talents may be needed to use the model effectively. Therefore, the chip model XC3064A-7PG132C is likely to be an important technology in the future.
You May Also Be Interested In
3,806 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||