AMD Xilinx
XC2VP70-6FFG1704I
XC2VP70-6FFG1704I ECAD Model
XC2VP70-6FFG1704I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 996 | |
| Number of Outputs | 996 | |
| Number of Logic Cells | 74448 | |
| Number of CLBs | 8272 | |
| Combinatorial Delay of a CLB-Max | 320 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 8272 CLBS | |
| Clock Frequency-Max | 1.2 GHz | |
| Power Supplies | 1.5,1.5/3.3,2/2.5,2.5 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B1704 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1704 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1704,42X42,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 3.45 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA1704,42X42,40 | |
| Pin Count | 1704 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.7.A | |
| HTS Code | 8542.39.00.01 |
XC2VP70-6FFG1704I Datasheet Download
XC2VP70-6FFG1704I Overview
The XC2VP70-6FFG1704I chip model is an integrated circuit designed for high-performance digital signal processing, embedded processing, and image processing applications. It is designed to be used with the HDL (Hardware Description Language) for development and implementation.
The XC2VP70-6FFG1704I chip model is part of a larger trend in the industry towards more powerful and complex integrated circuits. As new technologies emerge, they may be required to support the application environment in which the chip model is used.
The original design intention of the XC2VP70-6FFG1704I chip model was to provide a powerful and reliable solution for digital signal processing, embedded processing, and image processing applications. It is possible to upgrade the chip model in the future, depending on the specific needs of the application.
The XC2VP70-6FFG1704I chip model is also suitable for advanced communication systems. It can be used to develop and implement high-performance communication systems, such as wireless networks, cellular networks, and satellite communication systems. With its powerful capabilities, it can be used to develop and implement complex communication systems.
In conclusion, the XC2VP70-6FFG1704I chip model is an integrated circuit designed for high-performance digital signal processing, embedded processing, and image processing applications. It is part of a larger trend in the industry towards more powerful and complex integrated circuits. It is possible to upgrade the chip model in the future, depending on the specific needs of the application. It is also suitable for advanced communication systems, such as wireless networks, cellular networks, and satellite communication systems.
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4,783 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $4,388.8709 | $4,388.8709 |
| 10+ | $4,341.6787 | $43,416.7872 |
| 100+ | $4,105.7179 | $410,571.7920 |
| 1000+ | $3,869.7571 | $1,934,878.5600 |
| 10000+ | $3,539.4120 | $3,539,412.0000 |
| The price is for reference only, please refer to the actual quotation! | ||