XC2VP70-6FFG1704C
XC2VP70-6FFG1704C
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rohs

AMD Xilinx

XC2VP70-6FFG1704C


XC2VP70-6FFG1704C
F20-XC2VP70-6FFG1704C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, BGA, BGA1704,42X42,40
BGA, BGA1704,42X42,40

XC2VP70-6FFG1704C ECAD Model


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XC2VP70-6FFG1704C Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.5 V
Number of Inputs 996
Number of Outputs 996
Number of Logic Cells 74448
Number of CLBs 8272
Combinatorial Delay of a CLB-Max 320 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 8272 CLBS
Clock Frequency-Max 1.2 GHz
Power Supplies 1.5,1.5/3.3,2/2.5,2.5 V
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
JESD-30 Code S-PBGA-B1704
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1704
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1704,42X42,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 42.5 mm
Length 42.5 mm
Seated Height-Max 3.45 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description BGA, BGA1704,42X42,40
Pin Count 1704
Reach Compliance Code not_compliant
ECCN Code 3A001.A.7.A
HTS Code 8542.39.00.01

XC2VP70-6FFG1704C Datasheet Download


XC2VP70-6FFG1704C Overview



The XC2VP70-6FFG1704C chip model is a versatile and powerful device designed for high-performance digital signal processing, embedded processing, and image processing. It is capable of handling complex tasks and requires the use of a Hardware Description Language (HDL) for programming.


The XC2VP70-6FFG1704C is designed to be suitable for a wide range of applications, from large-scale networks to intelligent systems. It can be used for the development of autonomous systems and intelligent devices, as well as for the implementation of data processing algorithms and machine learning models. Its versatility makes it a suitable option for a variety of applications, from robotics and autonomous vehicles to smart home appliances and medical devices.


The product description and specific design requirements of the XC2VP70-6FFG1704C chip model can be found in the manufacturer's website. It is important to note that the device is not suitable for all applications and may require additional components or modifications to be able to perform certain tasks.


The XC2VP70-6FFG1704C chip model has been used in various projects and case studies, from the development of autonomous robots to the implementation of machine learning algorithms. It is important to note that the device may require additional components or modifications for certain tasks, and that it may not be able to handle all types of data processing tasks.


When designing with the XC2VP70-6FFG1704C chip model, it is important to consider the specific requirements of the application and the available resources. It is also important to be aware of the limitations of the device, such as its power consumption and processing speed, as these can affect the performance of the system. Additionally, it is important to ensure that the device is properly programmed, as this can greatly affect the performance of the system.


Overall, the XC2VP70-6FFG1704C chip model is a versatile, powerful device that can be used for a variety of applications. With the right design and programming, it can be used to develop autonomous systems and intelligent devices, as well as for data processing and machine learning algorithms. It is important to consider the specific requirements of the application and the available resources when designing with the XC2VP70-6FFG1704C chip model, as well as to be aware of the limitations of the device.



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