
AMD Xilinx
XC2VP70-6FFG1704C
XC2VP70-6FFG1704C ECAD Model
XC2VP70-6FFG1704C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.5 V | |
Number of Inputs | 996 | |
Number of Outputs | 996 | |
Number of Logic Cells | 74448 | |
Number of CLBs | 8272 | |
Combinatorial Delay of a CLB-Max | 320 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 8272 CLBS | |
Clock Frequency-Max | 1.2 GHz | |
Power Supplies | 1.5,1.5/3.3,2/2.5,2.5 V | |
Supply Voltage-Max | 1.575 V | |
Supply Voltage-Min | 1.425 V | |
JESD-30 Code | S-PBGA-B1704 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1704 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1704,42X42,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 42.5 mm | |
Length | 42.5 mm | |
Seated Height-Max | 3.45 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | BGA, BGA1704,42X42,40 | |
Pin Count | 1704 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A001.A.7.A | |
HTS Code | 8542.39.00.01 |
XC2VP70-6FFG1704C Datasheet Download
XC2VP70-6FFG1704C Overview
The XC2VP70-6FFG1704C chip model is a versatile and powerful device designed for high-performance digital signal processing, embedded processing, and image processing. It is capable of handling complex tasks and requires the use of a Hardware Description Language (HDL) for programming.
The XC2VP70-6FFG1704C is designed to be suitable for a wide range of applications, from large-scale networks to intelligent systems. It can be used for the development of autonomous systems and intelligent devices, as well as for the implementation of data processing algorithms and machine learning models. Its versatility makes it a suitable option for a variety of applications, from robotics and autonomous vehicles to smart home appliances and medical devices.
The product description and specific design requirements of the XC2VP70-6FFG1704C chip model can be found in the manufacturer's website. It is important to note that the device is not suitable for all applications and may require additional components or modifications to be able to perform certain tasks.
The XC2VP70-6FFG1704C chip model has been used in various projects and case studies, from the development of autonomous robots to the implementation of machine learning algorithms. It is important to note that the device may require additional components or modifications for certain tasks, and that it may not be able to handle all types of data processing tasks.
When designing with the XC2VP70-6FFG1704C chip model, it is important to consider the specific requirements of the application and the available resources. It is also important to be aware of the limitations of the device, such as its power consumption and processing speed, as these can affect the performance of the system. Additionally, it is important to ensure that the device is properly programmed, as this can greatly affect the performance of the system.
Overall, the XC2VP70-6FFG1704C chip model is a versatile, powerful device that can be used for a variety of applications. With the right design and programming, it can be used to develop autonomous systems and intelligent devices, as well as for data processing and machine learning algorithms. It is important to consider the specific requirements of the application and the available resources when designing with the XC2VP70-6FFG1704C chip model, as well as to be aware of the limitations of the device.
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