AMD Xilinx
XC2VP100-7FF1704C
XC2VP100-7FF1704C ECAD Model
XC2VP100-7FF1704C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 1040 | |
| Number of Outputs | 1040 | |
| Number of Logic Cells | 99216 | |
| Number of CLBs | 11024 | |
| Combinatorial Delay of a CLB-Max | 280 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 11024 CLBS | |
| Clock Frequency-Max | 1.35 GHz | |
| Power Supplies | 1.5,1.5/3.3,2/2.5,2.5 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B1704 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1704 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1704,42X42,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 3.45 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA1704,42X42,40 | |
| Pin Count | 1704 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC2VP100-7FF1704C Datasheet Download
XC2VP100-7FF1704C Overview
The XC2VP100-7FF1704C chip model is a high-performance, low-power programmable logic device that is ideal for a wide range of applications, including high-performance digital signal processing, embedded processing, and image processing. It is designed to be programmed using a Hardware Description Language (HDL) such as VHDL or Verilog, making it a versatile and powerful tool for engineers and developers.
The XC2VP100-7FF1704C chip model has a number of advantages over other models on the market. It is fast and efficient, with high-speed clock rates and low power consumption. It is also highly configurable, allowing for custom designs that can be tailored to specific application needs. Additionally, the chip is easy to use and has a wide range of development tools and support available.
The XC2VP100-7FF1704C chip model is currently in high demand in a number of industries, including automotive, industrial, and consumer electronics. As technology advances and new applications arise, the demand for this chip model is likely to continue to grow. Companies that invest in this chip model now will be well-positioned to take advantage of future opportunities.
The XC2VP100-7FF1704C chip model may require the use of new technologies in order to meet the demands of certain applications. For example, the chip may need to be used in conjunction with advanced image processing algorithms or other specialized technologies. However, the chip model is well-suited for a wide range of applications and its versatility makes it an attractive option for many businesses.
In conclusion, the XC2VP100-7FF1704C chip model is a powerful and versatile device that is well-suited for a variety of applications. Its high-performance, low-power design makes it an attractive option for businesses looking to take advantage of new technologies and opportunities. Its wide range of development tools and support make it easy to use, and its configurability allows for custom designs that can be tailored to specific application needs. As technology advances and new applications arise, the demand for this chip model is likely to continue to grow, making it an attractive option for businesses looking to invest in the future.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||