
AMD Xilinx
XC2VP100-6FFG1704C
XC2VP100-6FFG1704C ECAD Model
XC2VP100-6FFG1704C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.5 V | |
Number of Inputs | 1040 | |
Number of Outputs | 1040 | |
Number of Logic Cells | 99216 | |
Number of CLBs | 11024 | |
Combinatorial Delay of a CLB-Max | 320 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 11024 CLBS | |
Clock Frequency-Max | 1.2 GHz | |
Power Supplies | 1.5,1.5/3.3,2/2.5,2.5 V | |
Supply Voltage-Max | 1.575 V | |
Supply Voltage-Min | 1.425 V | |
JESD-30 Code | S-PBGA-B1704 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1704 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1704,42X42,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 42.5 mm | |
Length | 42.5 mm | |
Seated Height-Max | 3.45 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | BGA, BGA1704,42X42,40 | |
Pin Count | 1704 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A001.A.7.A | |
HTS Code | 8542.39.00.01 |
XC2VP100-6FFG1704C Datasheet Download
XC2VP100-6FFG1704C Overview
The XC2VP100-6FFG1704C chip model is a high-end FPGA from Xilinx, equipped with a Virtex-II Pro platform and a 6 million gate count. It has a wide range of applications in the fields of communications and computing, and has become an important part of modern networks.
The XC2VP100-6FFG1704C chip model has many advantages, such as low power consumption, high integration, and high performance. It also has a high degree of flexibility and scalability, making it suitable for a variety of applications. In addition, its small size and low cost make it one of the most popular FPGA models on the market.
The demand for the XC2VP100-6FFG1704C chip model is expected to grow in the future, as more and more industries are turning to FPGA technology for their networking and computing needs. As the technology continues to improve, the demand for this model is likely to increase.
The XC2VP100-6FFG1704C chip model can be used in a variety of intelligent scenarios, such as autonomous vehicles, smart homes, and industrial automation. It can also be used in the development and popularization of future intelligent robots. With its high performance and low power consumption, the model is well suited for these applications.
In order to use the XC2VP100-6FFG1704C chip model effectively, technical personnel must have a good understanding of FPGA technology, as well as experience in programming and debugging. They must also be familiar with the various tools and software available for working with FPGA technology.
In conclusion, the XC2VP100-6FFG1704C chip model has many advantages, and its demand is expected to increase in the future. It can be used in a variety of intelligent scenarios, and is well suited for the development and popularization of future intelligent robots. In order to use the model effectively, technical personnel must have a good understanding of FPGA technology and be familiar with the tools and software available for working with FPGA technology.
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4,018 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $7,382.0052 | $7,382.0052 |
10+ | $7,302.6288 | $73,026.2880 |
100+ | $6,905.7468 | $690,574.6800 |
1000+ | $6,508.8648 | $3,254,432.4000 |
10000+ | $5,953.2300 | $5,953,230.0000 |
The price is for reference only, please refer to the actual quotation! |