AMD Xilinx
XC2V2000-6FF896C
XC2V2000-6FF896C ECAD Model
XC2V2000-6FF896C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 624 | |
| Number of Outputs | 624 | |
| Number of Logic Cells | 24192 | |
| Number of Equivalent Gates | 2000000 | |
| Number of CLBs | 2688 | |
| Combinatorial Delay of a CLB-Max | 350 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2688 CLBS, 2000000 GATES | |
| Clock Frequency-Max | 820 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B896 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 896 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA896,30X30,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 31 mm | |
| Length | 31 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 31 X 31 MM, 1 MM PITCH, MS-034AAN-1, FLIP CHIP, FBGA-896 | |
| Pin Count | 896 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC2V2000-6FF896C Datasheet Download
XC2V2000-6FF896C Overview
The XC2V2000-6FF896C chip model is a state-of-the-art integrated circuit developed by Xilinx, Inc. It is designed for high-speed, low-power applications, such as digital signal processing and embedded systems. The chip model has a 6-layer metal-oxide-semiconductor field-effect transistor (MOSFET) architecture and is capable of delivering up to 2000 logic cells and 896 flip-flops.
The original design intention of the XC2V2000-6FF896C chip model was to provide a powerful and reliable platform for embedded systems and digital signal processing. With its advanced MOSFET architecture and high-speed logic cells, the chip model is capable of delivering high-performance and low-power solutions. In addition, the chip model also features built-in error correction and protection, making it highly reliable and suitable for use in mission-critical applications.
The XC2V2000-6FF896C chip model is also suitable for use in advanced communication systems. With its high-speed logic cells and built-in error correction, it can be used to process large amounts of data quickly and accurately. This makes it ideal for use in wireless communication systems, such as cellular networks, Wi-Fi networks, and satellite networks. Furthermore, the chip model can also be used in the development of intelligent systems, such as facial recognition systems and autonomous driving systems.
The XC2V2000-6FF896C chip model can also be used in the development and popularization of future intelligent robots. With its high-speed logic cells and built-in error correction, it can be used to process large amounts of data quickly and accurately. This makes it ideal for use in robotic systems, such as autonomous robots and robots with advanced artificial intelligence. In addition, the chip model can also be used in the development of intelligent systems, such as facial recognition systems and autonomous driving systems.
In order to use the XC2V2000-6FF896C chip model effectively, it is necessary to have a good understanding of digital signal processing and embedded systems. In addition, knowledge of circuit design, programming, and software development is also necessary. Furthermore, knowledge of artificial intelligence and robotics is also important, as these will be necessary for the development of intelligent robots. With the right technical talents, the XC2V2000-6FF896C chip model can be used to create powerful and reliable systems for the future.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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