AMD Xilinx
XC2V2000-4FF896C
XC2V2000-4FF896C ECAD Model
XC2V2000-4FF896C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 624 | |
| Number of Outputs | 624 | |
| Number of Logic Cells | 24192 | |
| Number of Equivalent Gates | 2000000 | |
| Number of CLBs | 2688 | |
| Combinatorial Delay of a CLB-Max | 440 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2688 CLBS, 2000000 GATES | |
| Clock Frequency-Max | 650 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B896 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 896 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA896,30X30,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 31 mm | |
| Length | 31 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 31 X 31 MM, 1 MM PITCH, MS-034AAN-1, FLIP CHIP, FBGA-896 | |
| Pin Count | 896 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC2V2000-4FF896C Datasheet Download
XC2V2000-4FF896C Overview
The XC2V2000-4FF896C chip model is a highly advanced piece of technology that has been developed to meet the needs of a wide range of industries. It is a multi-functional, versatile chip that has been designed to be used in a variety of applications. The chip model is designed to provide users with an efficient and reliable solution to their needs.
The XC2V2000-4FF896C chip model offers a number of advantages that make it an attractive option for many industries. It is designed to be highly reliable and efficient, with a low power consumption and a high performance level. The chip model also offers a wide range of features, including a wide range of memory and I/O options, as well as a wide range of communication protocols.
The XC2V2000-4FF896C chip model is expected to be in high demand in the future, as the need for reliable and efficient solutions increases. This is due to the increasing demand for advanced communication systems and the need for reliable and efficient solutions for these systems. The chip model is also expected to be upgraded in the future, as the technology continues to advance and new features are added.
The XC2V2000-4FF896C chip model is designed to meet the specific needs of its users. It is designed to be highly reliable, efficient and low power consumption. The chip model also has a wide range of features, including a wide range of memory and I/O options, as well as a wide range of communication protocols. The chip model is also designed to be highly compatible with a wide range of systems and applications.
In order to ensure that the XC2V2000-4FF896C chip model is used correctly and safely, it is important to understand the product description and specific design requirements of the chip model. This includes understanding the purpose of the chip model, the operating environment, the power requirements, and the communication protocols that the chip model is designed to support. It is also important to understand the actual case studies and precautions that should be taken when using the chip model.
Overall, the XC2V2000-4FF896C chip model is a highly advanced piece of technology that has been designed to meet the needs of a wide range of industries. It is designed to be highly reliable and efficient, with a low power consumption and a high performance level. The chip model also offers a wide range of features, including a wide range of memory and I/O options, as well as a wide range of communication protocols. It is expected to be in high demand in the future, and is also expected to be upgraded in the future to meet the needs of advanced communication systems. In order to ensure that the chip model is used correctly and safely, it is important to understand the product description and specific design requirements of the chip model, as well as the actual case studies and precautions that should be taken when using the chip model.
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2,734 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $589.7748 | $589.7748 |
| 10+ | $583.4331 | $5,834.3309 |
| 100+ | $551.7248 | $55,172.4768 |
| 1000+ | $520.0164 | $260,008.2240 |
| 10000+ | $475.6248 | $475,624.8000 |
| The price is for reference only, please refer to the actual quotation! | ||