AMD Xilinx
XC2V2000-6BGG575I
XC2V2000-6BGG575I ECAD Model
XC2V2000-6BGG575I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 408 | |
| Number of Outputs | 408 | |
| Number of Logic Cells | 24192 | |
| Number of Equivalent Gates | 2000000 | |
| Number of CLBs | 2688 | |
| Combinatorial Delay of a CLB-Max | 350 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2688 CLBS, 2000000 GATES | |
| Clock Frequency-Max | 820 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B575 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Number of Terminals | 575 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA575,24X24,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 31 mm | |
| Length | 31 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA575,24X24,50 | |
| Pin Count | 575 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XC2V2000-6BGG575I Datasheet Download
XC2V2000-6BGG575I Overview
The Xilinx XC2V2000-6BGG575I chip model is a leading-edge technology that has revolutionized the way we think about chip models and their applications. It is a Field Programmable Gate Array (FPGA) that provides high-performance, low-power capabilities with a wide variety of features and capabilities. This chip model is an ideal choice for a variety of applications, including high-speed data processing, digital signal processing, and embedded systems.
The XC2V2000-6BGG575I chip model has several advantages over other chip models. It has a higher processing speed, which allows for faster data processing and higher throughput. It also has a lower power consumption, which makes it more energy-efficient and cost-effective. Additionally, it has an array of features that make it more suitable for different applications. It has a wide range of configurable options, which makes it easier to customize for different applications.
The XC2V2000-6BGG575I chip model is expected to remain in high demand in the future. As the technology advances, the chip model will continue to be used for a variety of applications, including high-speed data processing, digital signal processing, and embedded systems. It is also expected to be used in the era of fully intelligent systems, as it is capable of running complex algorithms and providing data-driven insights.
The XC2V2000-6BGG575I chip model can be used in a variety of applications, including networks and intelligent scenarios. It is capable of running algorithms for data processing and analysis, as well as providing insights from collected data. This chip model is also capable of providing real-time decision-making, which makes it suitable for applications such as autonomous vehicles and smart homes.
In conclusion, the XC2V2000-6BGG575I chip model is a leading-edge technology that offers a wide range of features and capabilities. It has several advantages over other chip models, including higher processing speeds, lower power consumption, and a wide range of configurable options. It is expected to remain in high demand in the future and can be used in a variety of applications, including networks and intelligent scenarios. As the technology advances, the XC2V2000-6BGG575I chip model is expected to become even more useful in the era of fully intelligent systems.
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