AMD Xilinx
XC2V1000-5BG575C
XC2V1000-5BG575C ECAD Model
XC2V1000-5BG575C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 328 | |
| Number of Outputs | 328 | |
| Number of Logic Cells | 11520 | |
| Number of Equivalent Gates | 1000000 | |
| Number of CLBs | 1280 | |
| Combinatorial Delay of a CLB-Max | 390 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1280 CLBS, 1000000 GATES | |
| Clock Frequency-Max | 750 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B575 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Number of Terminals | 575 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA575,24X24,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 31 mm | |
| Length | 31 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA575,24X24,50 | |
| Pin Count | 575 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC2V1000-5BG575C Datasheet Download
XC2V1000-5BG575C Overview
The XC2V1000-5BG575C chip model is a high-performance, low-power FPGA designed for digital signal processing, embedded processing and image processing applications. It is a versatile and powerful device capable of meeting the most demanding requirements of various industries, such as medical, automotive, aerospace and defense.
The XC2V1000-5BG575C chip model is a high-end FPGA, which requires the use of HDL language for programming. This makes it suitable for a wide range of applications, such as embedded systems, image processing, and digital signal processing. It is also capable of supporting advanced technologies such as machine learning, artificial intelligence and 5G communication.
The XC2V1000-5BG575C chip model also offers a wide range of features that make it suitable for various applications. It supports high-speed I/O, advanced memory controllers, and high-speed transceivers. It also includes a variety of peripherals, such as a GPIO, a timer, and a PLL.
The XC2V1000-5BG575C chip model is easy to use and program, and can be used in a variety of development environments. It supports popular development platforms such as Linux, Windows and Mac OS. It also supports various programming languages, such as VHDL, Verilog and SystemVerilog.
In order to ensure the successful implementation of the XC2V1000-5BG575C chip model, it is important to understand the product description and design requirements. It is also important to consider the actual case studies and the precautions that need to be taken. There are a number of resources available to help designers understand the product and its features.
The XC2V1000-5BG575C chip model is a versatile and powerful device that can be used to meet the most demanding requirements of various industries. With its support for advanced technologies, it is sure to be an important part of the future development of related industries. As the demand for high-performance and low-power FPGAs grows, the XC2V1000-5BG575C chip model is sure to remain an important part of the industry.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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