AMD Xilinx
XC2V1000-6BGG575I
XC2V1000-6BGG575I ECAD Model
XC2V1000-6BGG575I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 328 | |
| Number of Outputs | 328 | |
| Number of Logic Cells | 11520 | |
| Number of Equivalent Gates | 1000000 | |
| Number of CLBs | 1280 | |
| Combinatorial Delay of a CLB-Max | 350 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1280 CLBS, 1000000 GATES | |
| Clock Frequency-Max | 820 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B575 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Number of Terminals | 575 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA575,24X24,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 31 mm | |
| Length | 31 mm | |
| Seated Height-Max | 2.6 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA575,24X24,50 | |
| Pin Count | 575 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
XC2V1000-6BGG575I Datasheet Download
XC2V1000-6BGG575I Overview
The Xilinx XC2V1000-6BGG575I chip model is a versatile, high-performance FPGA device designed for a range of applications, including advanced communication systems. It is an ideal choice for those looking for a reliable and cost-effective solution for their project.
The original design intention of the chip model XC2V1000-6BGG575I was to provide a flexible, low-power, and high-performance solution for a wide range of applications. It is capable of supporting a variety of communication protocols, making it an ideal choice for applications in communication systems. In addition, the chip model is capable of supporting a variety of logic functions, making it suitable for a range of applications.
The chip model XC2V1000-6BGG575I is capable of being upgraded for future applications. It supports the latest communication protocols and logic functions, allowing for future upgrades to be made without having to replace the chip. This makes it an ideal choice for those looking for a cost-effective and reliable solution for their project.
The chip model XC2V1000-6BGG575I is also capable of being applied to advanced communication systems. It supports a variety of communication protocols, making it suitable for a range of applications. In addition, the chip model is capable of supporting a variety of logic functions, making it suitable for a range of applications.
The chip model XC2V1000-6BGG575I is also capable of being used in the era of fully intelligent systems. It supports the latest communication protocols and logic functions, making it suitable for a range of applications. In addition, the chip model is capable of supporting a variety of logic functions, making it suitable for a range of intelligent scenarios.
The product description and specific design requirements of the chip model XC2V1000-6BGG575I are detailed in the product datasheet. It is important to read the datasheet carefully to ensure that the chip model is suitable for the intended application. It is also important to consider any potential issues that may arise from using the chip model, such as power consumption and heat dissipation.
In addition, there are a number of case studies available that provide insight into the use of the chip model XC2V1000-6BGG575I in a range of applications. These case studies provide valuable information about the performance of the chip model in different scenarios, as well as any potential issues that may arise from using the chip model.
Overall, the Xilinx XC2V1000-6BGG575I chip model is a versatile, high-performance FPGA device designed for a range of applications, including advanced communication systems. It is capable of being upgraded for future applications, as well as being used in the era of fully intelligent systems. The product description and specific design requirements of the chip model XC2V1000-6BGG575I are detailed in the product datasheet, and it is important to read the datasheet carefully to ensure that the chip model is suitable for the intended application. In addition, there are a number of case studies available that provide insight into the use of the chip model XC2V1000-6BGG575I in a range of applications.
You May Also Be Interested In
1,413 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||