AMD Xilinx
XC2V1500-6FF896I
XC2V1500-6FF896I ECAD Model
XC2V1500-6FF896I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 528 | |
| Number of Outputs | 528 | |
| Number of Logic Cells | 17280 | |
| Number of Equivalent Gates | 1500000 | |
| Number of CLBs | 1920 | |
| Combinatorial Delay of a CLB-Max | 350 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1920 CLBS, 1500000 GATES | |
| Clock Frequency-Max | 820 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B896 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 896 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA896,30X30,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 31 mm | |
| Length | 31 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 31 X 31 MM, 1 MM PITCH, MS-034AAN-1, FLIP CHIP, FBGA-896 | |
| Pin Count | 896 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC2V1500-6FF896I Datasheet Download
XC2V1500-6FF896I Overview
The chip model XC2V1500-6FF896I is a relatively new product in the chip industry, and has been widely used in various fields. It is a field programmable gate array (FPGA) chip with a wide range of applications. It is designed to be highly programmable, allowing users to customize their hardware to meet their specific needs.
The XC2V1500-6FF896I chip is capable of high-speed data processing and is suitable for a variety of applications. It is also capable of supporting a variety of communication protocols, making it an ideal choice for advanced communication systems. Furthermore, it is capable of providing a high degree of scalability, allowing users to easily upgrade their systems as their needs change.
In terms of future development, the XC2V1500-6FF896I chip is expected to be applied in more intelligent scenarios. It is possible that the chip could be used in the future for networks that are designed to support fully intelligent systems. This could include applications such as autonomous driving, smart home systems, and more. Furthermore, the chip is designed to be highly programmable, allowing users to customize their hardware to meet their specific needs.
Overall, the XC2V1500-6FF896I chip is a versatile and powerful chip model. It is capable of supporting a variety of communication protocols and is suitable for a variety of applications. It is also capable of providing a high degree of scalability, allowing users to easily upgrade their systems as their needs change. Furthermore, it is expected to be applied in more intelligent scenarios in the future, making it an ideal choice for advanced communication systems.
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