
AMD Xilinx
XC2V1500-6FF896C
XC2V1500-6FF896C ECAD Model
XC2V1500-6FF896C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.5 V | |
Number of Inputs | 528 | |
Number of Outputs | 528 | |
Number of Logic Cells | 17280 | |
Number of Equivalent Gates | 1500000 | |
Number of CLBs | 1920 | |
Combinatorial Delay of a CLB-Max | 350 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 1920 CLBS, 1500000 GATES | |
Clock Frequency-Max | 820 MHz | |
Power Supplies | 1.5,1.5/3.3,3.3 V | |
Supply Voltage-Max | 1.575 V | |
Supply Voltage-Min | 1.425 V | |
JESD-30 Code | S-PBGA-B896 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 896 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA896,30X30,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Lead (Sn63Pb37) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 31 mm | |
Length | 31 mm | |
Seated Height-Max | 3.4 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | 31 X 31 MM, 1 MM PITCH, MS-034AAN-1, FLIP CHIP, FBGA-896 | |
Pin Count | 896 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
XC2V1500-6FF896C Datasheet Download
XC2V1500-6FF896C Overview
The XC2V1500-6FF896C chip model is designed for high-performance digital signal processing, embedded processing, and image processing. It requires the use of HDL language and offers a powerful solution for these applications. With the rapid development of technology, the chip model is also evolving and being applied to more and more scenarios.
In the future, the XC2V1500-6FF896C chip model can be used in many intelligent scenarios, such as networks and fully intelligent systems. It can be used for various tasks, ranging from data processing to communication and control. In order to meet the demands of these applications, the chip model must support the latest technologies. For example, it must be able to support 5G networks and the Internet of Things. It must also be able to process large amounts of data in real-time, and support artificial intelligence algorithms.
The chip model can also be used in various other applications, such as robotics and autonomous vehicles. It can be used to process data from sensors and cameras, and it can be used to control the vehicle's movements. In order to achieve this, the chip model must be able to process the data quickly and accurately. It must also be able to support advanced algorithms, such as deep learning and machine learning.
The XC2V1500-6FF896C chip model is a powerful and versatile solution for many applications. It is suitable for a wide range of scenarios, from high-performance digital signal processing to embedded processing and image processing. It is also suitable for the future development of intelligent systems and networks. In order to make the most of the chip model, it must be able to support the latest technologies and algorithms. This will allow it to be used in a wide range of applications and scenarios.
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3,717 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $223.2000 | $223.2000 |
10+ | $220.8000 | $2,208.0000 |
100+ | $208.8000 | $20,880.0000 |
1000+ | $196.8000 | $98,400.0000 |
10000+ | $180.0000 | $180,000.0000 |
The price is for reference only, please refer to the actual quotation! |