AMD Xilinx
XC2V1000-6FFG896I
XC2V1000-6FFG896I ECAD Model
XC2V1000-6FFG896I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Equivalent Gates | 1000000 | |
| Number of CLBs | 1280 | |
| Combinatorial Delay of a CLB-Max | 350 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1280 CLBS, 1000000 GATES | |
| Clock Frequency-Max | 820 MHz | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B896 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 896 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 31 mm | |
| Length | 31 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 31 X 31 MM, 1 MM PITCH, MS-034AAN-1, FLIP CHIP, FBGA-896 | |
| Pin Count | 896 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC2V1000-6FFG896I Datasheet Download
XC2V1000-6FFG896I Overview
The XC2V1000-6FFG896I chip model is an advanced technology that is suitable for a multitude of high-performance digital signal processing, embedded processing, and image processing applications. It is the perfect choice for those who need to use the HDL language for their projects.
When it comes to the future applications of the XC2V1000-6FFG896I chip model, there is no doubt that it can be used in a variety of networks and intelligent scenarios. It can be used to build and maintain networks, as well as to develop and deploy intelligent applications. With its advanced features and capabilities, the XC2V1000-6FFG896I chip model can be used to create fully intelligent systems, making it a powerful tool for the future.
The XC2V1000-6FFG896I chip model is also suitable for the development and popularization of future intelligent robots. With its advanced features and capabilities, it can be used to create robots that can think, learn, and react to their environment. This can lead to a variety of applications, such as autonomous vehicles, home automation, and more. To use the XC2V1000-6FFG896I chip model effectively, one needs to have a solid understanding of the HDL language and a good grasp of the underlying hardware architecture. It also helps to have experience with embedded software development and a good understanding of the underlying algorithms.
You May Also Be Interested In
4,773 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||