AMD Xilinx
XC2V1000-6FF896C
XC2V1000-6FF896C ECAD Model
XC2V1000-6FF896C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 432 | |
| Number of Outputs | 432 | |
| Number of Logic Cells | 11520 | |
| Number of Equivalent Gates | 1000000 | |
| Number of CLBs | 1280 | |
| Combinatorial Delay of a CLB-Max | 350 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1280 CLBS, 1000000 GATES | |
| Clock Frequency-Max | 820 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B896 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 896 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA896,30X30,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 31 mm | |
| Length | 31 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 31 X 31 MM, 1 MM PITCH, MS-034AAN-1, FLIP CHIP, FBGA-896 | |
| Pin Count | 896 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC2V1000-6FF896C Datasheet Download
XC2V1000-6FF896C Overview
The XC2V1000-6FF896C chip model is a highly advanced, multi-functional and powerful model that is suitable for a variety of applications. It is ideal for high-performance digital signal processing, embedded processing, image processing, and other related tasks. To use this chip model, a Hardware Description Language (HDL) is required.
The XC2V1000-6FF896C chip model has several advantages that make it an attractive choice for many industries. It is compatible with a wide range of software, offers high-speed performance, and is highly reliable. Additionally, it is designed to be power-efficient and cost-effective, making it an attractive option for many businesses.
In terms of future industry trends, the XC2V1000-6FF896C chip model is likely to remain popular due to its versatility and cost-effectiveness. As technology advances, new technologies may be required to support the chip model in certain application environments. However, the specific technologies needed will depend on the specific application environment.
Overall, the XC2V1000-6FF896C chip model is an excellent choice for many industries. Its versatility, high-speed performance, and power-efficiency make it an attractive option for businesses looking for a cost-effective solution. As technology advances, new technologies may be needed to support the chip model in certain application environments, but the specific technologies needed will depend on the specific application environment. As such, the XC2V1000-6FF896C chip model is likely to remain popular in the future, as it is a cost-effective and reliable option.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||