AMD Xilinx
XC2V1000-4FF896C
XC2V1000-4FF896C ECAD Model
XC2V1000-4FF896C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 432 | |
| Number of Outputs | 432 | |
| Number of Logic Cells | 11520 | |
| Number of Equivalent Gates | 1000000 | |
| Number of CLBs | 1280 | |
| Combinatorial Delay of a CLB-Max | 440 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1280 CLBS, 1000000 GATES | |
| Clock Frequency-Max | 650 MHz | |
| Power Supplies | 1.5,1.5/3.3,3.3 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B896 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 896 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA896,30X30,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 31 mm | |
| Length | 31 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 31 X 31 MM, 1 MM PITCH, MS-034AAN-1, FLIP CHIP, FBGA-896 | |
| Pin Count | 896 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
XC2V1000-4FF896C Datasheet Download
XC2V1000-4FF896C Overview
The XC2V1000-4FF896C is a highly versatile chip model that is suitable for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language, making it an ideal choice for those who want to maximize their system's performance.
The industry trends of the XC2V1000-4FF896C chip model are constantly evolving. As new technologies become available, the application environment for the chip model may require additional support. It is important to keep up with the latest developments in order to ensure that the chip model is able to meet the needs of the application environment.
The product description and specific design requirements of the XC2V1000-4FF896C chip model should be thoroughly reviewed before implementation. It is important to understand the exact features and capabilities of the chip model in order to ensure that it can meet the requirements of the application. Additionally, case studies and precautions should be taken into consideration when designing with the chip model.
Overall, the XC2V1000-4FF896C chip model is an excellent choice for those who need high-performance digital signal processing, embedded processing, and image processing. It is important to stay up to date on the latest industry trends and technologies in order to ensure that the chip model is able to meet the requirements of the application environment. Additionally, the product description and design requirements should be thoroughly reviewed before implementation in order to ensure that the chip model is able to meet the needs of the application.
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4,221 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $12.6430 | $12.6430 |
| 10+ | $12.5070 | $125.0703 |
| 100+ | $11.8273 | $1,182.7302 |
| 1000+ | $11.1476 | $5,573.7860 |
| 10000+ | $10.1960 | $10,195.9500 |
| The price is for reference only, please refer to the actual quotation! | ||