AMD Xilinx
XC2S50E-7FTG256C
XC2S50E-7FTG256C ECAD Model
XC2S50E-7FTG256C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 182 | |
| Number of Outputs | 182 | |
| Number of Logic Cells | 1728 | |
| Number of Equivalent Gates | 23000 | |
| Number of CLBs | 384 | |
| Combinatorial Delay of a CLB-Max | 420 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 384 CLBS, 23000 GATES | |
| Additional Feature | MAXIMUM USABLE GATES = 50000 | |
| Clock Frequency-Max | 400 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LEAD FREE, FBGA-256 | |
| Pin Count | 256 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XC2S50E-7FTG256C Datasheet Download
XC2S50E-7FTG256C Overview
The chip model XC2S50E-7FTG256C is a high-performance and versatile FPGA chip. It is suitable for a wide range of applications, including high-performance digital signal processing, embedded processing, image processing, and more. This chip is designed to be used with HDL language, a hardware description language that is used to create digital designs that can be easily implemented in a variety of hardware platforms.
The XC2S50E-7FTG256C has a number of advantages that make it an attractive choice for many applications. It has a high-speed and low-power design, making it suitable for high-performance applications. It also has a large number of configurable I/O pins, allowing for flexible design options. Additionally, the chip is designed to be easy to use and program, making it an ideal choice for those who need to quickly and easily program their designs.
The demand for this chip model is expected to increase in the future as more applications require high-performance and low-power chips. As the technology behind digital signal processing, embedded processing, and image processing continues to improve, the XC2S50E-7FTG256C will become an increasingly popular choice for those looking for a reliable and powerful chip.
When designing with the XC2S50E-7FTG256C, it is important to understand the product description and specific design requirements. The chip has a wide range of features and capabilities, and it is important to understand how to use them in order to achieve the desired results. Additionally, it is important to understand the design requirements of the chip, such as the number of I/O pins and the clock speed. It is also important to understand the power requirements and the types of design tools that are available for working with the chip.
Case studies and practical examples can be very helpful when designing with the XC2S50E-7FTG256C. By studying the design of existing applications, it is possible to gain a better understanding of the chip's capabilities and how to best use them. Additionally, it is important to be aware of any potential pitfalls or design flaws that could cause problems in the finished product.
The XC2S50E-7FTG256C is a powerful and versatile chip that is suitable for a wide range of applications. By understanding the product description, design requirements, and potential pitfalls, it is possible to design with this chip in a way that is both efficient and effective. With its high-speed and low-power design, the XC2S50E-7FTG256C is expected to become increasingly popular in the future.
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2,778 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $20.6981 | $20.6981 |
| 10+ | $20.4755 | $204.7552 |
| 100+ | $19.3627 | $1,936.2720 |
| 1000+ | $18.2499 | $9,124.9600 |
| 10000+ | $16.6920 | $16,692.0000 |
| The price is for reference only, please refer to the actual quotation! | ||