XC2S50E-6FTG256C
XC2S50E-6FTG256C
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rohs

AMD Xilinx

XC2S50E-6FTG256C


XC2S50E-6FTG256C
F20-XC2S50E-6FTG256C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, LEAD FREE, FBGA-256
LEAD FREE, FBGA-256

XC2S50E-6FTG256C ECAD Model


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XC2S50E-6FTG256C Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.8 V
Number of Inputs 182
Number of Outputs 182
Number of Logic Cells 1728
Number of Equivalent Gates 23000
Number of CLBs 384
Combinatorial Delay of a CLB-Max 470 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 384 CLBS, 23000 GATES
Additional Feature MAXIMUM USABLE GATES = 50000
Clock Frequency-Max 357 MHz
Power Supplies 1.2/3.6,1.8 V
Supply Voltage-Max 1.89 V
Supply Voltage-Min 1.71 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 17 mm
Length 17 mm
Seated Height-Max 2 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description LEAD FREE, FBGA-256
Pin Count 256
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.39.00.01

XC2S50E-6FTG256C Datasheet Download


XC2S50E-6FTG256C Overview



The XC2S50E-6FTG256C chip model is a powerful and versatile device that is suitable for a variety of applications, such as high-performance digital signal processing, embedded processing, and image processing. It requires the use of HDL language, and its product description, design requirements, and actual case studies should all be taken into consideration when using it.


The chip model XC2S50E-6FTG256C is part of a larger industry trend towards the development of more powerful and efficient chips. As technology advances and new technologies become available, the application environment for the chip model will need to be updated to take advantage of these new technologies. This could include new programming languages, more efficient algorithms, or more powerful processors.


The design of the XC2S50E-6FTG256C chip model should take into account the specific needs of the application. Depending on the application, different design requirements may be necessary. For example, if the application requires high-performance digital signal processing, then the chip model should be designed to handle this type of processing. Similarly, if the application requires embedded processing, then the chip model should be designed to handle this type of processing.


When designing the XC2S50E-6FTG256C chip model, it is important to consider actual case studies and precautions. For example, if the chip model is being used for image processing, then it is important to consider the potential for data loss due to noise or other interference. Additionally, it is important to consider the potential for data corruption due to improper coding or hardware failure.


In conclusion, the XC2S50E-6FTG256C chip model is a powerful and versatile device that is suitable for a variety of applications. It requires the use of HDL language, and its design should take into account the specific needs of the application. Additionally, it is important to consider actual case studies and precautions when designing the chip model. With the right design, the XC2S50E-6FTG256C chip model can be a powerful tool for high-performance digital signal processing, embedded processing, and image processing.



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Unit Price: $55.1968
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QTY Unit Price Ext Price
1+ $51.3330 $51.3330
10+ $50.7811 $507.8106
100+ $48.0212 $4,802.1216
1000+ $45.2614 $22,630.6880
10000+ $41.3976 $41,397.6000
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