AMD Xilinx
XC2S50E-6FTG256I
XC2S50E-6FTG256I ECAD Model
XC2S50E-6FTG256I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 182 | |
| Number of Outputs | 182 | |
| Number of Logic Cells | 1728 | |
| Number of Equivalent Gates | 23000 | |
| Number of CLBs | 384 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 384 CLBS, 23000 GATES | |
| Additional Feature | MAXIMUM USABLE GATES = 50000 | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LEAD FREE, FBGA-256 | |
| Pin Count | 256 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XC2S50E-6FTG256I Datasheet Download
XC2S50E-6FTG256I Overview
The XC2S50E-6FTG256I chip model is a high-performance integrated circuit designed for digital signal processing, embedded processing, image processing, and other applications. It is built on a Field Programmable Gate Array (FPGA) platform and requires the use of HDL language for programming. The XC2S50E-6FTG256I is a powerful and versatile chip model that offers several advantages over traditional microprocessors and other integrated circuits.
The XC2S50E-6FTG256I is capable of processing large amounts of data quickly and accurately, making it an ideal choice for high-performance applications. It also features a low power consumption and improved heat dissipation, making it suitable for use in energy-efficient systems. Furthermore, the XC2S50E-6FTG256I is highly configurable, allowing users to customize the chip model to meet their specific needs.
The XC2S50E-6FTG256I chip model is expected to become increasingly popular in the future due to its wide range of applications and its performance advantages. It is likely to be used in a variety of industries, such as automotive, aerospace, medical, and consumer electronics. The chip model is also expected to be used in the development and popularization of future intelligent robots, as it is capable of providing the necessary processing power, accuracy, and speed.
In order to use the XC2S50E-6FTG256I chip model effectively, it is important to have a good understanding of the HDL language. A basic knowledge of digital signal processing, embedded processing, and image processing is also essential. Additionally, having a strong background in mathematics and engineering can be beneficial when working with the XC2S50E-6FTG256I chip model. With the right skills and knowledge, the XC2S50E-6FTG256I chip model can be used to develop and popularize future intelligent robots.
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5,973 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $59.5467 | $59.5467 |
| 10+ | $58.9064 | $589.0640 |
| 100+ | $55.7050 | $5,570.4969 |
| 1000+ | $52.5035 | $26,251.7670 |
| 10000+ | $48.0215 | $48,021.5250 |
| The price is for reference only, please refer to the actual quotation! | ||