
AMD Xilinx
XC2S400E-6FTG256I
XC2S400E-6FTG256I ECAD Model
XC2S400E-6FTG256I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.8 V | |
Number of Inputs | 410 | |
Number of Outputs | 410 | |
Number of Logic Cells | 10800 | |
Number of Equivalent Gates | 145000 | |
Number of CLBs | 2400 | |
Combinatorial Delay of a CLB-Max | 470 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 2400 CLBS, 145000 GATES | |
Additional Feature | MAXIMUM USABLE GATES = 400000 | |
Clock Frequency-Max | 357 MHz | |
Power Supplies | 1.2/3.6,1.8 V | |
Supply Voltage-Max | 1.89 V | |
Supply Voltage-Min | 1.71 V | |
JESD-30 Code | S-PBGA-B256 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Peak Reflow Temperature (Cel) | 260 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 256 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA256,16X16,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 17 mm | |
Length | 17 mm | |
Seated Height-Max | 2 mm | |
Ihs Manufacturer | XILINX INC | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 | |
Part Package Code | BGA | |
Package Description | LEAD FREE, FBGA-256 | |
Pin Count | 256 | |
ECCN Code | EAR99 |
XC2S400E-6FTG256I Datasheet Download
XC2S400E-6FTG256I Overview
The XC2S400E-6FTG256I is a high-performance Field Programmable Gate Array (FPGA) chip model, manufactured by Xilinx. It is designed for high-performance digital signal processing, embedded processing, image processing, and other applications. This chip model is ideal for those who require high-end performance and the use of Hardware Description Language (HDL) for their project.
The XC2S400E-6FTG256I offers several advantages over other chip models. It has a high-speed differential I/O, allowing for faster data transmission and increased system performance. It also features an embedded memory that is capable of storing up to 256 megabytes of data. Additionally, the chip model has a low power consumption, making it suitable for applications that require energy efficiency.
In terms of design requirements, the XC2S400E-6FTG256I requires the use of HDL code. This code can be written in either Verilog or VHDL and must be compatible with the Xilinx ISE Design Suite. It is important to ensure that the code is written correctly and is compatible with the chip model before attempting to program it. Additionally, the chip model requires a 12V power supply and a clock frequency of at least 50 MHz.
The XC2S400E-6FTG256I chip model is already being used in a variety of industries, including automotive, consumer electronics, and industrial automation. With the increasing demand for high-performance digital signal processing and embedded processing, the demand for this chip model is expected to continue to grow in the coming years.
To provide a better understanding of the XC2S400E-6FTG256I chip model, it is important to look at actual case studies. For example, the chip model was used in a project to control a robotic arm. The code was written in Verilog and was successfully programmed onto the chip. Additionally, the chip was able to successfully control the robotic arm and perform the desired tasks.
Finally, it is important to take precautions when programming the XC2S400E-6FTG256I chip model. It is important to ensure that the code is compatible with the chip model and that the power supply and clock frequency requirements are met. Additionally, it is important to ensure that the code is written correctly and that all necessary safety measures are taken.
In conclusion, the XC2S400E-6FTG256I is a high-performance FPGA chip model that is suitable for a variety of applications. It offers several advantages, including a high-speed differential I/O, embedded memory, and low power consumption. Additionally, the chip model requires the use of HDL code and has specific design requirements. The demand for this chip model is expected to continue to grow in the coming years, making it an ideal choice for those who require high-end performance and energy efficiency.
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