XC2S400E-6FTG256I
XC2S400E-6FTG256I
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rohs

AMD Xilinx

XC2S400E-6FTG256I


XC2S400E-6FTG256I
F20-XC2S400E-6FTG256I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, LEAD FREE, FBGA-256
LEAD FREE, FBGA-256

XC2S400E-6FTG256I ECAD Model


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XC2S400E-6FTG256I Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.8 V
Number of Inputs 410
Number of Outputs 410
Number of Logic Cells 10800
Number of Equivalent Gates 145000
Number of CLBs 2400
Combinatorial Delay of a CLB-Max 470 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Organization 2400 CLBS, 145000 GATES
Additional Feature MAXIMUM USABLE GATES = 400000
Clock Frequency-Max 357 MHz
Power Supplies 1.2/3.6,1.8 V
Supply Voltage-Max 1.89 V
Supply Voltage-Min 1.71 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 17 mm
Length 17 mm
Seated Height-Max 2 mm
Ihs Manufacturer XILINX INC
Reach Compliance Code unknown
HTS Code 8542.39.00.01
Part Package Code BGA
Package Description LEAD FREE, FBGA-256
Pin Count 256
ECCN Code EAR99

XC2S400E-6FTG256I Datasheet Download


XC2S400E-6FTG256I Overview



The XC2S400E-6FTG256I is a high-performance Field Programmable Gate Array (FPGA) chip model, manufactured by Xilinx. It is designed for high-performance digital signal processing, embedded processing, image processing, and other applications. This chip model is ideal for those who require high-end performance and the use of Hardware Description Language (HDL) for their project.


The XC2S400E-6FTG256I offers several advantages over other chip models. It has a high-speed differential I/O, allowing for faster data transmission and increased system performance. It also features an embedded memory that is capable of storing up to 256 megabytes of data. Additionally, the chip model has a low power consumption, making it suitable for applications that require energy efficiency.


In terms of design requirements, the XC2S400E-6FTG256I requires the use of HDL code. This code can be written in either Verilog or VHDL and must be compatible with the Xilinx ISE Design Suite. It is important to ensure that the code is written correctly and is compatible with the chip model before attempting to program it. Additionally, the chip model requires a 12V power supply and a clock frequency of at least 50 MHz.


The XC2S400E-6FTG256I chip model is already being used in a variety of industries, including automotive, consumer electronics, and industrial automation. With the increasing demand for high-performance digital signal processing and embedded processing, the demand for this chip model is expected to continue to grow in the coming years.


To provide a better understanding of the XC2S400E-6FTG256I chip model, it is important to look at actual case studies. For example, the chip model was used in a project to control a robotic arm. The code was written in Verilog and was successfully programmed onto the chip. Additionally, the chip was able to successfully control the robotic arm and perform the desired tasks.


Finally, it is important to take precautions when programming the XC2S400E-6FTG256I chip model. It is important to ensure that the code is compatible with the chip model and that the power supply and clock frequency requirements are met. Additionally, it is important to ensure that the code is written correctly and that all necessary safety measures are taken.


In conclusion, the XC2S400E-6FTG256I is a high-performance FPGA chip model that is suitable for a variety of applications. It offers several advantages, including a high-speed differential I/O, embedded memory, and low power consumption. Additionally, the chip model requires the use of HDL code and has specific design requirements. The demand for this chip model is expected to continue to grow in the coming years, making it an ideal choice for those who require high-end performance and energy efficiency.



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