AMD Xilinx
XC2S400E-6FTG256C
XC2S400E-6FTG256C ECAD Model
XC2S400E-6FTG256C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 410 | |
| Number of Outputs | 410 | |
| Number of Logic Cells | 10800 | |
| Number of Equivalent Gates | 145000 | |
| Number of CLBs | 2400 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2400 CLBS, 145000 GATES | |
| Additional Feature | MAXIMUM USABLE GATES = 400000 | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LEAD FREE, FBGA-256 | |
| Pin Count | 256 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XC2S400E-6FTG256C Datasheet Download
XC2S400E-6FTG256C Overview
The XC2S400E-6FTG256C chip model is a powerful tool for digital signal processing, embedded processing, and image processing. It is designed to be used in conjunction with HDL language, making it a perfect choice for those wanting to create complex and sophisticated designs.
The XC2S400E-6FTG256C chip model has become increasingly popular in recent years due to its impressive performance and reliability. This chip model is capable of delivering high-speed data processing, which is essential for modern applications. It is also designed to be highly energy-efficient, making it a great choice for those who need to reduce power consumption.
The industry trends of the XC2S400E-6FTG256C chip model and its future development are largely dependent on the specific technologies that are needed. For example, if a design requires the use of a high-speed processor, then the XC2S400E-6FTG256C chip model is a great choice. On the other hand, if the design requires the use of a low-power processor, then a different chip model might be more suitable.
When using the XC2S400E-6FTG256C chip model, it is important to pay attention to the product description and specific design requirements. This includes things like the clock speed, power requirements, and other features. It is also important to consider any actual case studies or precautions that may be relevant to the design. For example, if the design requires the use of a high-speed processor, then it is important to ensure that the chip model is capable of running at the required speed.
Overall, the XC2S400E-6FTG256C chip model is an excellent choice for those looking to create high-performance digital signal processing, embedded processing, and image processing designs. It is designed to be used in conjunction with HDL language, making it a great choice for those who need to create complex designs. Furthermore, the industry trends and future development of the chip model depend on the specific technologies that are needed, making it important to consider the product description and design requirements before beginning the design process.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||