AMD Xilinx
XC2S300E-6FTG256I
XC2S300E-6FTG256I ECAD Model
XC2S300E-6FTG256I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 329 | |
| Number of Outputs | 329 | |
| Number of Logic Cells | 6912 | |
| Number of Equivalent Gates | 93000 | |
| Number of CLBs | 1536 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1536 CLBS, 93000 GATES | |
| Additional Feature | MAXIMUM USABLE GATES = 300000 | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LEAD FREE, FBGA-256 | |
| Pin Count | 256 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XC2S300E-6FTG256I Datasheet Download
XC2S300E-6FTG256I Overview
The XC2S300E-6FTG256I is a high-performance chip model that offers a wide range of applications in digital signal processing, embedded processing, and image processing. It is designed with the HDL language as its primary programming language, giving it the flexibility to be used in advanced communication systems.
The XC2S300E-6FTG256I is a versatile chip model that can be used in a wide range of applications. It has a high-performance design, with a 256-bit FPGA, and can handle complex tasks quickly and efficiently. It is also designed with an upgradeable architecture, allowing for future improvements and upgrades.
The XC2S300E-6FTG256I is designed to meet specific design requirements and specifications. It has a wide range of features, including a high-speed processor, a large memory capacity, and a high-performance bus. It also has a wide range of input and output options, allowing for a variety of connections to other components.
When using the XC2S300E-6FTG256I, there are a few considerations to keep in mind. First, it is important to ensure that the chip model is compatible with the desired application. Additionally, it is important to ensure that the programming language used is compatible with the chip model. Finally, it is important to ensure that the chip model is properly configured, and that the appropriate drivers are installed.
To demonstrate the capabilities of the XC2S300E-6FTG256I, there are a number of case studies that can be reviewed. These case studies show how the chip model can be used in a variety of applications, and how it can be configured to meet specific design requirements. Additionally, these case studies provide insight into the range of features and capabilities of the chip model, and how it can be used to improve performance and efficiency.
In conclusion, the XC2S300E-6FTG256I is a high-performance chip model that is designed to meet specific design requirements. It is designed with an upgradeable architecture, allowing for future improvements and upgrades. It is also designed with the HDL language as its primary programming language, giving it the flexibility to be used in advanced communication systems. With a wide range of features and capabilities, the XC2S300E-6FTG256I is a versatile chip model that can be used in a wide range of applications.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||