
AMD Xilinx
XC2S200E-6FTG256I
XC2S200E-6FTG256I ECAD Model
XC2S200E-6FTG256I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.8 V | |
Number of Inputs | 289 | |
Number of Outputs | 289 | |
Number of Logic Cells | 5292 | |
Number of Equivalent Gates | 71000 | |
Number of CLBs | 1176 | |
Combinatorial Delay of a CLB-Max | 470 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 1176 CLBS, 71000 GATES | |
Additional Feature | MAXIMUM USABLE GATES = 200000 | |
Clock Frequency-Max | 357 MHz | |
Power Supplies | 1.2/3.6,1.8 V | |
Supply Voltage-Max | 1.89 V | |
Supply Voltage-Min | 1.71 V | |
JESD-30 Code | S-PBGA-B256 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Peak Reflow Temperature (Cel) | 260 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 256 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA256,16X16,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 17 mm | |
Length | 17 mm | |
Seated Height-Max | 2 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | LEAD FREE, FBGA-256 | |
Pin Count | 256 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 |
XC2S200E-6FTG256I Datasheet Download
XC2S200E-6FTG256I Overview
The XC2S200E-6FTG256I chip model is a powerful and versatile solution for a variety of applications. It is suitable for high-performance digital signal processing, embedded processing, and image processing, all of which require the use of HDL language. This chip model is capable of handling a wide range of tasks and is suitable for a variety of industries.
The XC2S200E-6FTG256I chip model is capable of being used in a wide range of industries, such as automotive, aerospace, medical, industrial automation, and consumer electronics. It can be used for high-performance computing, digital signal processing, embedded processing, image processing, and other applications. The chip is compatible with a variety of operating systems and can be used in both wired and wireless networks.
The XC2S200E-6FTG256I chip model is capable of being used for a variety of applications in the future. It can be used for networks and intelligent scenarios, such as autonomous vehicles, robotics, and smart home systems. It can be used in the era of fully intelligent systems, as it is capable of processing large amounts of data quickly and efficiently. It is also capable of being used in a variety of industries, such as automotive, aerospace, medical, industrial automation, and consumer electronics.
The XC2S200E-6FTG256I chip model is a powerful and versatile solution for a variety of applications. It is suitable for high-performance digital signal processing, embedded processing, and image processing, all of which require the use of HDL language. This chip model is capable of handling a wide range of tasks and is suitable for a variety of industries. It can be used for networks and intelligent scenarios, such as autonomous vehicles, robotics, and smart home systems. It can be used in the era of fully intelligent systems, as it is capable of processing large amounts of data quickly and efficiently. It is also capable of being used in a variety of industries, such as automotive, aerospace, medical, industrial automation, and consumer electronics. The XC2S200E-6FTG256I chip model is a powerful and reliable solution for the future of digital signal processing, embedded processing, and image processing.
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Pricing (USD)
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