XC2S200E-6FTG256I
XC2S200E-6FTG256I
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rohs

AMD Xilinx

XC2S200E-6FTG256I


XC2S200E-6FTG256I
F20-XC2S200E-6FTG256I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, LEAD FREE, FBGA-256
LEAD FREE, FBGA-256

XC2S200E-6FTG256I ECAD Model


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XC2S200E-6FTG256I Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.8 V
Number of Inputs 289
Number of Outputs 289
Number of Logic Cells 5292
Number of Equivalent Gates 71000
Number of CLBs 1176
Combinatorial Delay of a CLB-Max 470 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Organization 1176 CLBS, 71000 GATES
Additional Feature MAXIMUM USABLE GATES = 200000
Clock Frequency-Max 357 MHz
Power Supplies 1.2/3.6,1.8 V
Supply Voltage-Max 1.89 V
Supply Voltage-Min 1.71 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 17 mm
Length 17 mm
Seated Height-Max 2 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description LEAD FREE, FBGA-256
Pin Count 256
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.39.00.01

XC2S200E-6FTG256I Datasheet Download


XC2S200E-6FTG256I Overview



The XC2S200E-6FTG256I chip model is a powerful and versatile solution for a variety of applications. It is suitable for high-performance digital signal processing, embedded processing, and image processing, all of which require the use of HDL language. This chip model is capable of handling a wide range of tasks and is suitable for a variety of industries.


The XC2S200E-6FTG256I chip model is capable of being used in a wide range of industries, such as automotive, aerospace, medical, industrial automation, and consumer electronics. It can be used for high-performance computing, digital signal processing, embedded processing, image processing, and other applications. The chip is compatible with a variety of operating systems and can be used in both wired and wireless networks.


The XC2S200E-6FTG256I chip model is capable of being used for a variety of applications in the future. It can be used for networks and intelligent scenarios, such as autonomous vehicles, robotics, and smart home systems. It can be used in the era of fully intelligent systems, as it is capable of processing large amounts of data quickly and efficiently. It is also capable of being used in a variety of industries, such as automotive, aerospace, medical, industrial automation, and consumer electronics.


The XC2S200E-6FTG256I chip model is a powerful and versatile solution for a variety of applications. It is suitable for high-performance digital signal processing, embedded processing, and image processing, all of which require the use of HDL language. This chip model is capable of handling a wide range of tasks and is suitable for a variety of industries. It can be used for networks and intelligent scenarios, such as autonomous vehicles, robotics, and smart home systems. It can be used in the era of fully intelligent systems, as it is capable of processing large amounts of data quickly and efficiently. It is also capable of being used in a variety of industries, such as automotive, aerospace, medical, industrial automation, and consumer electronics. The XC2S200E-6FTG256I chip model is a powerful and reliable solution for the future of digital signal processing, embedded processing, and image processing.



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