XC2S200E-6FTG256C
XC2S200E-6FTG256C
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rohs

AMD Xilinx

XC2S200E-6FTG256C


XC2S200E-6FTG256C
F20-XC2S200E-6FTG256C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, LEAD FREE, FBGA-256
LEAD FREE, FBGA-256

XC2S200E-6FTG256C ECAD Model


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XC2S200E-6FTG256C Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.8 V
Number of Inputs 289
Number of Outputs 289
Number of Logic Cells 5292
Number of Equivalent Gates 71000
Number of CLBs 1176
Combinatorial Delay of a CLB-Max 470 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 1176 CLBS, 71000 GATES
Additional Feature MAXIMUM USABLE GATES = 200000
Clock Frequency-Max 357 MHz
Power Supplies 1.2/3.6,1.8 V
Supply Voltage-Max 1.89 V
Supply Voltage-Min 1.71 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 17 mm
Length 17 mm
Seated Height-Max 2 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description LEAD FREE, FBGA-256
Pin Count 256
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.39.00.01

XC2S200E-6FTG256C Datasheet Download


XC2S200E-6FTG256C Overview



The Xilinx XC2S200E-6FTG256C is a powerful, low-cost, low-power Field Programmable Gate Array (FPGA) chip designed to meet the needs of a wide range of applications. This chip is part of the Spartan-II family of FPGAs, which are based on the 0.25-micron CMOS process, making them ideal for embedded systems, networking, and communication systems.


The XC2S200E-6FTG256C chip is designed with a range of features to meet the needs of a wide variety of applications. It has 200 logic cells, 256 Kbits of embedded SRAM, and two 18-bit multipliers. It also has two dedicated clocks, two global clock networks, and two high-speed I/O banks. All of these features make it an ideal choice for applications requiring high performance and low power consumption.


The XC2S200E-6FTG256C chip can be applied to a wide range of applications, including advanced communication systems. The chip is designed with a range of features to meet the needs of such systems, including a high-speed serial transceiver, a high-speed LVDS transceiver, and a DDR2 SDRAM controller. The chip also has a range of other features, such as a 10/100 Ethernet MAC, a PCI Express controller, and a USB 2.0 controller.


The XC2S200E-6FTG256C chip can also be used in the development and popularization of future intelligent robots. The chip has a range of features that make it well-suited for robotics applications, including a high-speed serial transceiver, a high-speed LVDS transceiver, and a DDR2 SDRAM controller. It also has a range of other features, such as a 10/100 Ethernet MAC, a PCI Express controller, and a USB 2.0 controller.


In order to use the XC2S200E-6FTG256C chip effectively, it is important to understand the original design intention of the chip and the possibility of future upgrades. It is also important to understand the product description and specific design requirements of the chip, as well as actual case studies and precautions. Technical expertise in the areas of embedded systems, networking, and communication systems is needed to use the chip effectively.


In conclusion, the XC2S200E-6FTG256C chip is a powerful, low-cost, low-power Field Programmable Gate Array (FPGA) chip that can be applied to a wide range of applications, including advanced communication systems and the development and popularization of future intelligent robots. In order to use the chip effectively, it is important to understand the original design intention of the chip and the possibility of future upgrades, as well as the product description and specific design requirements of the chip. Technical expertise in the areas of embedded systems, networking, and communication systems is also needed to use the chip effectively.



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