
AMD Xilinx
XC2S200E-6FTG256C
XC2S200E-6FTG256C ECAD Model
XC2S200E-6FTG256C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.8 V | |
Number of Inputs | 289 | |
Number of Outputs | 289 | |
Number of Logic Cells | 5292 | |
Number of Equivalent Gates | 71000 | |
Number of CLBs | 1176 | |
Combinatorial Delay of a CLB-Max | 470 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 1176 CLBS, 71000 GATES | |
Additional Feature | MAXIMUM USABLE GATES = 200000 | |
Clock Frequency-Max | 357 MHz | |
Power Supplies | 1.2/3.6,1.8 V | |
Supply Voltage-Max | 1.89 V | |
Supply Voltage-Min | 1.71 V | |
JESD-30 Code | S-PBGA-B256 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 260 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 256 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA256,16X16,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 17 mm | |
Length | 17 mm | |
Seated Height-Max | 2 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | LEAD FREE, FBGA-256 | |
Pin Count | 256 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 |
XC2S200E-6FTG256C Datasheet Download
XC2S200E-6FTG256C Overview
The Xilinx XC2S200E-6FTG256C is a powerful, low-cost, low-power Field Programmable Gate Array (FPGA) chip designed to meet the needs of a wide range of applications. This chip is part of the Spartan-II family of FPGAs, which are based on the 0.25-micron CMOS process, making them ideal for embedded systems, networking, and communication systems.
The XC2S200E-6FTG256C chip is designed with a range of features to meet the needs of a wide variety of applications. It has 200 logic cells, 256 Kbits of embedded SRAM, and two 18-bit multipliers. It also has two dedicated clocks, two global clock networks, and two high-speed I/O banks. All of these features make it an ideal choice for applications requiring high performance and low power consumption.
The XC2S200E-6FTG256C chip can be applied to a wide range of applications, including advanced communication systems. The chip is designed with a range of features to meet the needs of such systems, including a high-speed serial transceiver, a high-speed LVDS transceiver, and a DDR2 SDRAM controller. The chip also has a range of other features, such as a 10/100 Ethernet MAC, a PCI Express controller, and a USB 2.0 controller.
The XC2S200E-6FTG256C chip can also be used in the development and popularization of future intelligent robots. The chip has a range of features that make it well-suited for robotics applications, including a high-speed serial transceiver, a high-speed LVDS transceiver, and a DDR2 SDRAM controller. It also has a range of other features, such as a 10/100 Ethernet MAC, a PCI Express controller, and a USB 2.0 controller.
In order to use the XC2S200E-6FTG256C chip effectively, it is important to understand the original design intention of the chip and the possibility of future upgrades. It is also important to understand the product description and specific design requirements of the chip, as well as actual case studies and precautions. Technical expertise in the areas of embedded systems, networking, and communication systems is needed to use the chip effectively.
In conclusion, the XC2S200E-6FTG256C chip is a powerful, low-cost, low-power Field Programmable Gate Array (FPGA) chip that can be applied to a wide range of applications, including advanced communication systems and the development and popularization of future intelligent robots. In order to use the chip effectively, it is important to understand the original design intention of the chip and the possibility of future upgrades, as well as the product description and specific design requirements of the chip. Technical expertise in the areas of embedded systems, networking, and communication systems is also needed to use the chip effectively.
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