XC2S150E-6FTG256I
XC2S150E-6FTG256I
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rohs

AMD Xilinx

XC2S150E-6FTG256I


XC2S150E-6FTG256I
F20-XC2S150E-6FTG256I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, LEAD FREE, FBGA-256
LEAD FREE, FBGA-256

XC2S150E-6FTG256I ECAD Model


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XC2S150E-6FTG256I Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.8 V
Number of Inputs 265
Number of Outputs 265
Number of Logic Cells 3888
Number of Equivalent Gates 52000
Number of CLBs 864
Combinatorial Delay of a CLB-Max 470 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Organization 864 CLBS, 52000 GATES
Additional Feature MAXIMUM USABLE GATES = 150000
Clock Frequency-Max 357 MHz
Power Supplies 1.2/3.6,1.8 V
Supply Voltage-Max 1.89 V
Supply Voltage-Min 1.71 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 17 mm
Length 17 mm
Seated Height-Max 2 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description LEAD FREE, FBGA-256
Pin Count 256
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.39.00.01

XC2S150E-6FTG256I Datasheet Download


XC2S150E-6FTG256I Overview



The chip model XC2S150E-6FTG256I is an important part of the semiconductor industry and its application in the information and communication technology (ICT) industry is becoming increasingly prominent. It is a field-programmable gate array (FPGA) chip that can be used to implement complex functions in the network, and it has been widely used in the industry. With the rapid development of artificial intelligence, cloud computing, and big data, the chip model XC2S150E-6FTG256I is playing an increasingly important role in the development of the ICT industry.


In terms of industry trends, the chip model XC2S150E-6FTG256I has been widely used in the development of networks and intelligent scenarios, and many new technologies have been developed to support its application. For example, the chip model can be used in the development of 5G networks and intelligent robots, and new technologies such as artificial intelligence (AI) and deep learning can be used to improve the performance of the chip model. In addition, the chip model can be used to develop and popularize future intelligent robots, and it requires the support of various technical talents to use the model effectively.


In the era of fully intelligent systems, the chip model XC2S150E-6FTG256I will become more important. With the development of AI and cloud computing, the chip model can be used to develop more efficient and intelligent systems. In addition, the chip model can be used to build more powerful and intelligent robots, which can be used to solve various problems in the future. Moreover, the chip model can be used to develop more advanced applications, such as smart homes and intelligent transportation systems, which can make our lives more convenient.


In conclusion, the chip model XC2S150E-6FTG256I is an important part of the semiconductor industry, and its application in the ICT industry is becoming increasingly prominent. It has been widely used in the development of networks and intelligent scenarios, and many new technologies have been developed to support its application. In the era of fully intelligent systems, the chip model will become more important and can be used to develop more efficient and intelligent systems, as well as powerful and intelligent robots. In order to use the chip model effectively, various technical talents are needed to support its application.



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