
AMD Xilinx
XC2S150E-6FTG256I
XC2S150E-6FTG256I ECAD Model
XC2S150E-6FTG256I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.8 V | |
Number of Inputs | 265 | |
Number of Outputs | 265 | |
Number of Logic Cells | 3888 | |
Number of Equivalent Gates | 52000 | |
Number of CLBs | 864 | |
Combinatorial Delay of a CLB-Max | 470 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 864 CLBS, 52000 GATES | |
Additional Feature | MAXIMUM USABLE GATES = 150000 | |
Clock Frequency-Max | 357 MHz | |
Power Supplies | 1.2/3.6,1.8 V | |
Supply Voltage-Max | 1.89 V | |
Supply Voltage-Min | 1.71 V | |
JESD-30 Code | S-PBGA-B256 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 3 | |
Peak Reflow Temperature (Cel) | 260 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 256 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA256,16X16,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 17 mm | |
Length | 17 mm | |
Seated Height-Max | 2 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | LEAD FREE, FBGA-256 | |
Pin Count | 256 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 |
XC2S150E-6FTG256I Datasheet Download
XC2S150E-6FTG256I Overview
The chip model XC2S150E-6FTG256I is an important part of the semiconductor industry and its application in the information and communication technology (ICT) industry is becoming increasingly prominent. It is a field-programmable gate array (FPGA) chip that can be used to implement complex functions in the network, and it has been widely used in the industry. With the rapid development of artificial intelligence, cloud computing, and big data, the chip model XC2S150E-6FTG256I is playing an increasingly important role in the development of the ICT industry.
In terms of industry trends, the chip model XC2S150E-6FTG256I has been widely used in the development of networks and intelligent scenarios, and many new technologies have been developed to support its application. For example, the chip model can be used in the development of 5G networks and intelligent robots, and new technologies such as artificial intelligence (AI) and deep learning can be used to improve the performance of the chip model. In addition, the chip model can be used to develop and popularize future intelligent robots, and it requires the support of various technical talents to use the model effectively.
In the era of fully intelligent systems, the chip model XC2S150E-6FTG256I will become more important. With the development of AI and cloud computing, the chip model can be used to develop more efficient and intelligent systems. In addition, the chip model can be used to build more powerful and intelligent robots, which can be used to solve various problems in the future. Moreover, the chip model can be used to develop more advanced applications, such as smart homes and intelligent transportation systems, which can make our lives more convenient.
In conclusion, the chip model XC2S150E-6FTG256I is an important part of the semiconductor industry, and its application in the ICT industry is becoming increasingly prominent. It has been widely used in the development of networks and intelligent scenarios, and many new technologies have been developed to support its application. In the era of fully intelligent systems, the chip model will become more important and can be used to develop more efficient and intelligent systems, as well as powerful and intelligent robots. In order to use the chip model effectively, various technical talents are needed to support its application.
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