XC2S150E-6FTG256C
XC2S150E-6FTG256C
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rohs

AMD Xilinx

XC2S150E-6FTG256C


XC2S150E-6FTG256C
F20-XC2S150E-6FTG256C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, LEAD FREE, FBGA-256
LEAD FREE, FBGA-256

XC2S150E-6FTG256C ECAD Model


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XC2S150E-6FTG256C Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Supply Voltage-Nom 1.8 V
Number of Inputs 265
Number of Outputs 265
Number of Logic Cells 3888
Number of Equivalent Gates 52000
Number of CLBs 864
Combinatorial Delay of a CLB-Max 470 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 864 CLBS, 52000 GATES
Additional Feature MAXIMUM USABLE GATES = 150000
Clock Frequency-Max 357 MHz
Power Supplies 1.2/3.6,1.8 V
Supply Voltage-Max 1.89 V
Supply Voltage-Min 1.71 V
JESD-30 Code S-PBGA-B256
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 256
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 17 mm
Length 17 mm
Seated Height-Max 2 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description LEAD FREE, FBGA-256
Pin Count 256
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.39.00.01

XC2S150E-6FTG256C Datasheet Download


XC2S150E-6FTG256C Overview



The XC2S150E-6FTG256C chip model is a product of Xilinx, Inc., a leading semiconductor manufacturer. It was designed to meet the needs of a wide range of applications, including communications systems, networks, and intelligent robots.


The XC2S150E-6FTG256C chip model is a field programmable gate array (FPGA) device that is designed to provide high performance and low power. It is capable of supporting up to 256 logic cells and can be used in a variety of applications, including communication systems, networks, and intelligent robots.


The XC2S150E-6FTG256C chip model is designed to be easily upgradable, allowing for future upgrades and applications. It is also designed to be compatible with a variety of advanced communication systems, allowing for the development of high-speed networks and intelligent robots.


The XC2S150E-6FTG256C chip model is capable of supporting a variety of intelligent scenarios, including voice recognition, facial recognition, and natural language processing. It is also capable of supporting the development of intelligent robots, which can be used in a variety of applications, including manufacturing, healthcare, and transportation.


In order to use the XC2S150E-6FTG256C chip model effectively, technical talents are needed who are familiar with the design and implementation of FPGA devices. They must be able to understand the underlying principles of FPGA design and be able to develop efficient and reliable applications. Additionally, they must be able to integrate the chip model into existing systems and be able to troubleshoot any issues that may arise.


In conclusion, the XC2S150E-6FTG256C chip model is a highly advanced and versatile device that is capable of supporting a wide range of applications. It is easily upgradable and compatible with advanced communication systems, allowing for the development of high-speed networks and intelligent robots. In order to use the chip model effectively, technical talents are needed who are familiar with the design and implementation of FPGA devices.



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Unit Price: $22.848
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QTY Unit Price Ext Price
1+ $21.2486 $21.2486
10+ $21.0202 $210.2016
100+ $19.8778 $1,987.7760
1000+ $18.7354 $9,367.6800
10000+ $17.1360 $17,136.0000
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