AMD Xilinx
XC2S100E-7FTG256C
XC2S100E-7FTG256C ECAD Model
XC2S100E-7FTG256C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 202 | |
| Number of Outputs | 202 | |
| Number of Logic Cells | 2700 | |
| Number of Equivalent Gates | 37000 | |
| Number of CLBs | 600 | |
| Combinatorial Delay of a CLB-Max | 420 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 600 CLBS, 37000 GATES | |
| Additional Feature | MAXIMUM USABLE GATES = 100000 | |
| Clock Frequency-Max | 400 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LEAD FREE, FBGA-256 | |
| Pin Count | 256 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XC2S100E-7FTG256C Datasheet Download
XC2S100E-7FTG256C Overview
The XC2S100E-7FTG256C chip model is a powerful tool for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with HDL (Hardware Description Language) and is capable of performing complex operations quickly and efficiently. The original design intention of the chip model was to provide a reliable platform for advanced communication systems and intelligent solutions.
The XC2S100E-7FTG256C chip model is equipped with the latest technology, making it suitable for a variety of applications. It is capable of handling large amounts of data and can be used for a wide range of tasks, including network communication, image processing, and artificial intelligence. The chip model is also capable of performing complex operations at high speeds, making it ideal for use in advanced communication systems.
The XC2S100E-7FTG256C chip model can be used in a variety of intelligent scenarios, such as machine learning and natural language processing. It is also capable of being used in the era of fully intelligent systems, as it is designed to handle large amounts of data quickly and accurately. Its ability to process data quickly and accurately makes it an ideal choice for advanced communication systems, as well as intelligent solutions.
The XC2S100E-7FTG256C chip model is an incredibly powerful tool for high-performance digital signal processing and embedded processing. Its original design intention was to provide a reliable platform for advanced communication systems and intelligent solutions, and its ability to process data quickly and accurately makes it an ideal choice for these applications. Furthermore, it is capable of being used in a variety of intelligent scenarios, such as machine learning and natural language processing, making it a great tool for the era of fully intelligent systems.
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5,843 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $352.7290 | $352.7290 |
| 10+ | $348.9362 | $3,489.3622 |
| 100+ | $329.9723 | $32,997.2295 |
| 1000+ | $311.0084 | $155,504.1850 |
| 10000+ | $284.4589 | $284,458.8750 |
| The price is for reference only, please refer to the actual quotation! | ||