AMD Xilinx
XC2S100E-6FTG256I
XC2S100E-6FTG256I ECAD Model
XC2S100E-6FTG256I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 202 | |
| Number of Outputs | 202 | |
| Number of Logic Cells | 2700 | |
| Number of Equivalent Gates | 37000 | |
| Number of CLBs | 600 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 600 CLBS, 37000 GATES | |
| Additional Feature | MAXIMUM USABLE GATES = 100000 | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 260 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LEAD FREE, FBGA-256 | |
| Pin Count | 256 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | EAR99 |
XC2S100E-6FTG256I Datasheet Download
XC2S100E-6FTG256I Overview
XC2S100E-6FTG256I is a versatile chip model designed to meet the needs of high-performance digital signal processing, embedded processing, image processing, and other applications. It is a field-programmable gate array (FPGA) device that utilizes the Xilinx Spartan-IIE family of devices. It is capable of providing up to 256 logic cells, 16-bit multipliers, and 16Kbits of RAM.
The XC2S100E-6FTG256I is a cost-effective solution for those looking for a reliable and powerful chip model. It offers a wide range of features and benefits, such as fast performance, low power consumption, and a flexible design. It is also compatible with the industry-standard HDL language, making it easy to design and develop applications for the chip model.
The XC2S100E-6FTG256I is a versatile chip model that is suitable for a wide range of applications and industries. It is particularly useful for the development of high-performance digital signal processing, embedded processing, and image processing applications. Its high performance and low power consumption make it a great choice for these applications.
The demand for the XC2S100E-6FTG256I is expected to continue to increase in the future as more applications and industries are developed that require the use of this chip model. It is a reliable and cost-effective solution that can be used in a variety of applications.
When designing applications for the XC2S100E-6FTG256I, it is important to consider the specific design requirements for the chip model. It is important to understand the features and capabilities of the chip model, as well as the design constraints and limitations. It is also important to understand the specific HDL language and development tools that are required to design the application.
Case studies have shown that the XC2S100E-6FTG256I is a reliable and cost-effective solution for various applications. In particular, it has been used in applications such as digital signal processing, embedded processing, and image processing. It has also been used in applications such as radar systems and medical imaging.
When designing applications for the XC2S100E-6FTG256I, it is important to consider the specific design requirements for the chip model. It is also important to consider the specific HDL language and development tools that are required to design the application. Additionally, it is important to be aware of the potential risks and limitations of the chip model, such as power consumption and design constraints.
Overall, the XC2S100E-6FTG256I is a versatile chip model that is suitable for a wide range of applications and industries. Its high performance and low power consumption make it a great choice for digital signal processing, embedded processing, and image processing applications. The demand for the XC2S100E-6FTG256I is expected to continue to increase in the future, making it a reliable and cost-effective solution for various applications.
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1,640 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $22.7664 | $22.7664 |
| 10+ | $22.5216 | $225.2160 |
| 100+ | $21.2976 | $2,129.7600 |
| 1000+ | $20.0736 | $10,036.8000 |
| 10000+ | $18.3600 | $18,360.0000 |
| The price is for reference only, please refer to the actual quotation! | ||