XC2C384-7FG324C
XC2C384-7FG324C
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rohs

AMD Xilinx

XC2C384-7FG324C


XC2C384-7FG324C
F20-XC2C384-7FG324C
Active
FLASH PLD, 7.5 ns, 384-Cell, CMOS, 23 X 23 MM, 1 MM PITCH, FBGA-324
23 X 23 MM, 1 MM PITCH, FBGA-324

XC2C384-7FG324C ECAD Model


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XC2C384-7FG324C Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Active
Supply Voltage-Nom 1.8 V
Propagation Delay 7.5 ns
Number of Inputs 240
Number of Outputs 240
Number of Macro Cells 384
Number of I/O Lines 240
Programmable Logic Type FLASH PLD
Temperature Grade COMMERCIAL
Package Shape SQUARE
Technology CMOS
Organization 0 DEDICATED INPUTS, 240 I/O
Additional Feature YES
Architecture PLA-TYPE
Clock Frequency-Max 112 MHz
In-System Programmable YES
JTAG BST YES
Output Function MACROCELL
Power Supplies 1.5/3.3,1.8 V
Supply Voltage-Max 1.9 V
Supply Voltage-Min 1.7 V
JESD-30 Code S-PBGA-B324
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 70 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 324
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA324,22X22,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 23 mm
Length 23 mm
Seated Height-Max 2.5 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description 23 X 23 MM, 1 MM PITCH, FBGA-324
Pin Count 324
Reach Compliance Code not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XC2C384-7FG324C Datasheet Download


XC2C384-7FG324C Overview



The chip model XC2C384-7FG324C has been gaining traction in the industry as a reliable and efficient solution for a variety of applications. This chip model has been developed to meet the needs of modern applications, with a focus on providing users with the features they need while still providing a cost-effective solution.


This chip model is designed to provide a high level of performance and reliability, with low power consumption and a wide variety of features. It is designed to meet the needs of a wide range of applications, from consumer electronics to industrial applications. It is also designed to be flexible and adaptable to the changing needs of the industry.


The XC2C384-7FG324C is designed to provide a wide range of features, including high-speed communication, advanced power management, and high-end security. It also provides a wide range of interfaces, including USB, Ethernet, and Bluetooth. This chip model also provides a wide range of memory and storage options, including DDR3 and NAND Flash.


The XC2C384-7FG324C is designed to provide a high level of performance and reliability, while still providing a cost-effective solution. It is designed to provide a wide range of features, while still providing a low power consumption. It is also designed to be flexible and adaptable to the changing needs of the industry.


In terms of industry trends, the XC2C384-7FG324C is expected to continue to gain traction in the industry, as more and more applications require its features and capabilities. This chip model is also expected to be in high demand in the future, as more and more applications require its features and capabilities.


In terms of the application environment, it is important to consider the specific technologies that are needed to support the XC2C384-7FG324C. Depending on the application, different technologies may be required. For example, if the application requires high-speed communication, then the chip model may need to support Ethernet or USB. Similarly, if the application requires high-end security, then the chip model may need to support advanced encryption technologies.


It is also important to consider the design requirements of the XC2C384-7FG324C. This chip model is designed to provide a wide range of features, while still providing a low power consumption. It is important to consider the specific design requirements of the application, such as the type of memory and storage required, the type of interfaces needed, and the type of power management needed.


Finally, it is important to consider actual case studies and precautions when using the XC2C384-7FG324C. This chip model has been designed to provide a high level of performance and reliability, while still providing a cost-effective solution. It is important to consider actual case studies and precautions when using the chip model, such as the type of environment the chip model is being used in, the type of application the chip model is being used for, and the type of power management and security features that are needed.


In conclusion, the chip model XC2C384-7FG324C is a reliable and efficient solution for a variety of applications. It is designed to provide a high level of performance and reliability, while still providing a cost-effective solution. It is expected to continue to gain traction in the industry, as more and more applications require its features and capabilities. It is important to consider the specific technologies that are needed to support the chip model, as well as the design requirements of the application, and actual case studies and precautions when using the chip model.



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QTY Unit Price Ext Price
1+ $34.2835 $34.2835
10+ $33.9149 $339.1488
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10000+ $27.6480 $27,648.0000
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