
AMD Xilinx
XC2C384-7FG324C
XC2C384-7FG324C ECAD Model
XC2C384-7FG324C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1.8 V | |
Propagation Delay | 7.5 ns | |
Number of Inputs | 240 | |
Number of Outputs | 240 | |
Number of Macro Cells | 384 | |
Number of I/O Lines | 240 | |
Programmable Logic Type | FLASH PLD | |
Temperature Grade | COMMERCIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 0 DEDICATED INPUTS, 240 I/O | |
Additional Feature | YES | |
Architecture | PLA-TYPE | |
Clock Frequency-Max | 112 MHz | |
In-System Programmable | YES | |
JTAG BST | YES | |
Output Function | MACROCELL | |
Power Supplies | 1.5/3.3,1.8 V | |
Supply Voltage-Max | 1.9 V | |
Supply Voltage-Min | 1.7 V | |
JESD-30 Code | S-PBGA-B324 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 70 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 324 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA324,22X22,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 23 mm | |
Length | 23 mm | |
Seated Height-Max | 2.5 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | 23 X 23 MM, 1 MM PITCH, FBGA-324 | |
Pin Count | 324 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
XC2C384-7FG324C Datasheet Download
XC2C384-7FG324C Overview
The chip model XC2C384-7FG324C has been gaining traction in the industry as a reliable and efficient solution for a variety of applications. This chip model has been developed to meet the needs of modern applications, with a focus on providing users with the features they need while still providing a cost-effective solution.
This chip model is designed to provide a high level of performance and reliability, with low power consumption and a wide variety of features. It is designed to meet the needs of a wide range of applications, from consumer electronics to industrial applications. It is also designed to be flexible and adaptable to the changing needs of the industry.
The XC2C384-7FG324C is designed to provide a wide range of features, including high-speed communication, advanced power management, and high-end security. It also provides a wide range of interfaces, including USB, Ethernet, and Bluetooth. This chip model also provides a wide range of memory and storage options, including DDR3 and NAND Flash.
The XC2C384-7FG324C is designed to provide a high level of performance and reliability, while still providing a cost-effective solution. It is designed to provide a wide range of features, while still providing a low power consumption. It is also designed to be flexible and adaptable to the changing needs of the industry.
In terms of industry trends, the XC2C384-7FG324C is expected to continue to gain traction in the industry, as more and more applications require its features and capabilities. This chip model is also expected to be in high demand in the future, as more and more applications require its features and capabilities.
In terms of the application environment, it is important to consider the specific technologies that are needed to support the XC2C384-7FG324C. Depending on the application, different technologies may be required. For example, if the application requires high-speed communication, then the chip model may need to support Ethernet or USB. Similarly, if the application requires high-end security, then the chip model may need to support advanced encryption technologies.
It is also important to consider the design requirements of the XC2C384-7FG324C. This chip model is designed to provide a wide range of features, while still providing a low power consumption. It is important to consider the specific design requirements of the application, such as the type of memory and storage required, the type of interfaces needed, and the type of power management needed.
Finally, it is important to consider actual case studies and precautions when using the XC2C384-7FG324C. This chip model has been designed to provide a high level of performance and reliability, while still providing a cost-effective solution. It is important to consider actual case studies and precautions when using the chip model, such as the type of environment the chip model is being used in, the type of application the chip model is being used for, and the type of power management and security features that are needed.
In conclusion, the chip model XC2C384-7FG324C is a reliable and efficient solution for a variety of applications. It is designed to provide a high level of performance and reliability, while still providing a cost-effective solution. It is expected to continue to gain traction in the industry, as more and more applications require its features and capabilities. It is important to consider the specific technologies that are needed to support the chip model, as well as the design requirements of the application, and actual case studies and precautions when using the chip model.
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2,161 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $34.2835 | $34.2835 |
10+ | $33.9149 | $339.1488 |
100+ | $32.0717 | $3,207.1680 |
1000+ | $30.2285 | $15,114.2400 |
10000+ | $27.6480 | $27,648.0000 |
The price is for reference only, please refer to the actual quotation! |