
AMD Xilinx
XC2C384-6FG324C
XC2C384-6FG324C ECAD Model
XC2C384-6FG324C Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.8 V | |
Propagation Delay | 6 ns | |
Number of Macro Cells | 384 | |
Number of I/O Lines | 240 | |
Programmable Logic Type | FLASH PLD | |
Temperature Grade | COMMERCIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 0 DEDICATED INPUTS, 240 I/O | |
Additional Feature | YES | |
In-System Programmable | YES | |
JTAG BST | YES | |
Output Function | MACROCELL | |
Power Supplies | 1.5/3.3,1.8 V | |
Supply Voltage-Max | 1.9 V | |
Supply Voltage-Min | 1.7 V | |
JESD-30 Code | S-PBGA-B324 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 70 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 324 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA324,22X22,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Lead (Sn63Pb37) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 23 mm | |
Length | 23 mm | |
Seated Height-Max | 2.5 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | 23 X 23 MM, 1 MM PITCH, FBGA-324 | |
Pin Count | 324 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 | |
ECCN Code | 3A991.D |
XC2C384-6FG324C Datasheet Download
XC2C384-6FG324C Overview
AMD Xilinx offers a wide range of electronic components for various applications, and one such component is the XC2C384-6FG324C. This component can be purchased from FMALL, a reputable supplier of electronic components.
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