XC2C384-10FG324C
XC2C384-10FG324C
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rohs

AMD Xilinx

XC2C384-10FG324C


XC2C384-10FG324C
F20-XC2C384-10FG324C
Active
FLASH PLD, 10 ns, 384-Cell, CMOS, 23 X 23 MM, 1 MM PITCH, FBGA-324
23 X 23 MM, 1 MM PITCH, FBGA-324

XC2C384-10FG324C ECAD Model


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XC2C384-10FG324C Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Active
Supply Voltage-Nom 1.8 V
Propagation Delay 10 ns
Number of Inputs 240
Number of Outputs 240
Number of Macro Cells 384
Number of I/O Lines 240
Programmable Logic Type FLASH PLD
Temperature Grade COMMERCIAL
Package Shape SQUARE
Technology CMOS
Organization 0 DEDICATED INPUTS, 240 I/O
Additional Feature YES
Architecture PLA-TYPE
Clock Frequency-Max 83 MHz
In-System Programmable YES
JTAG BST YES
Output Function MACROCELL
Power Supplies 1.5/3.3,1.8 V
Supply Voltage-Max 1.9 V
Supply Voltage-Min 1.7 V
JESD-30 Code S-PBGA-B324
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 70 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 324
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA324,22X22,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 23 mm
Length 23 mm
Seated Height-Max 2.5 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description 23 X 23 MM, 1 MM PITCH, FBGA-324
Pin Count 324
Reach Compliance Code not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XC2C384-10FG324C Datasheet Download


XC2C384-10FG324C Overview



The chip model XC2C384-10FG324C is a highly advanced semiconductor device designed for use in a wide variety of applications. This model is manufactured by Xilinx, a leading provider of programmable logic components. It is a low-power, high-performance, low-cost FPGA with a wide range of features and capabilities.


The XC2C384-10FG324C is designed to offer significant advantages over other FPGAs. It is capable of providing faster processing speeds than traditional FPGAs, while also consuming less energy. This makes it an attractive choice for applications that require high performance and low power consumption. Additionally, the XC2C384-10FG324C is highly configurable, allowing users to customize their designs to meet specific requirements.


When it comes to industry trends, the XC2C384-10FG324C is well-suited for use in a variety of applications. It is an ideal choice for embedded systems, communications systems, and other industrial applications. As technology advances, the XC2C384-10FG324C is likely to remain a popular choice for many applications.


Regarding the future development of related industries, the XC2C384-10FG324C is likely to remain an important component of many applications. It is likely that new technologies will be needed to support the application environment, but the exact requirements will depend on the specific application.


The original design intention of the XC2C384-10FG324C was to provide a low-cost, high-performance FPGA with a wide range of features and capabilities. It was designed to be highly configurable and capable of providing faster processing speeds than traditional FPGAs while consuming less energy.


It is possible to upgrade the XC2C384-10FG324C, but it is important to consider the specific requirements of the application before making any changes. Additionally, it is important to understand the potential risks associated with making such an upgrade.


When it comes to product description and design requirements, the XC2C384-10FG324C is a highly advanced semiconductor device designed for use in a wide variety of applications. It is a low-power, high-performance, low-cost FPGA with a wide range of features and capabilities. The device is highly configurable and capable of providing faster processing speeds than traditional FPGAs while consuming less energy.


In order to ensure the success of any project involving the XC2C384-10FG324C, it is important to understand the specific requirements of the application and the potential risks associated with making any changes. Additionally, it is important to consider actual case studies and any potential precautions that may be necessary.


In conclusion, the XC2C384-10FG324C is a highly advanced semiconductor device designed for use in a wide variety of applications. It is capable of providing faster processing speeds than traditional FPGAs while also consuming less energy. It is likely to remain an important component of many applications, and new technologies may be needed to support the application environment. Additionally, it is important to understand the original design intention of the XC2C384-10FG324C, the possibility of future upgrades, and the product description and design requirements. Understanding these aspects is essential for ensuring the success of any project involving the XC2C384-10FG324C.



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QTY Unit Price Ext Price
1+ $107.5043 $107.5043
10+ $106.3483 $1,063.4832
100+ $100.5685 $10,056.8520
1000+ $94.7887 $47,394.3600
10000+ $86.6970 $86,697.0000
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