AMD Xilinx
XC2C256-6CP132C
XC2C256-6CP132C ECAD Model
XC2C256-6CP132C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.8 V | |
| Propagation Delay | 6 ns | |
| Number of Inputs | 106 | |
| Number of Outputs | 106 | |
| Number of Macro Cells | 256 | |
| Number of I/O Lines | 106 | |
| Programmable Logic Type | FLASH PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 0 DEDICATED INPUTS, 106 I/O | |
| Additional Feature | REAL DIGITAL DESIGN TECHNOLOGY | |
| Architecture | PLA-TYPE | |
| Clock Frequency-Max | 139 MHz | |
| In-System Programmable | YES | |
| JTAG BST | YES | |
| Output Function | MACROCELL | |
| Power Supplies | 1.5/3.3,1.8 V | |
| Supply Voltage-Max | 1.9 V | |
| Supply Voltage-Min | 1.7 V | |
| JESD-30 Code | S-PBGA-B132 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 240 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 132 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA132,14X14,20 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 500 µm | |
| Terminal Position | BOTTOM | |
| Width | 8 mm | |
| Length | 8 mm | |
| Seated Height-Max | 1.1 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 8 X 8 MM, 0.50 MM PITCH, CSP-132 | |
| Pin Count | 132 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 |
XC2C256-6CP132C Datasheet Download
XC2C256-6CP132C Overview
The Xilinx XC2C256-6CP132C chip model is a high-performance, low-power, cost-effective FPGA (Field Programmable Gate Array) designed for a wide range of applications. It is ideal for use in embedded systems, automotive, industrial, and medical applications, as well as for the development of embedded systems and intelligent robots. In this article, we will discuss the advantages of the XC2C256-6CP132C chip model, the expected demand trends for the model in related industries in the future, the product description and specific design requirements of the model, actual case studies and precautions, and the potential application of the model in the development and popularization of future intelligent robots.
The XC2C256-6CP132C chip model has several advantages. It has a high-speed, low-power operation, with a power consumption of only 1.3 watts. It is also designed to be highly reliable, with a long-term reliability of up to 20 years. It is also highly configurable, with a large number of I/O pins and a wide range of features. In addition, the XC2C256-6CP132C is also highly cost-effective, with a low cost per unit.
Given the advantages of the XC2C256-6CP132C chip model, it is expected to experience increasing demand in related industries in the future. The model is highly suitable for use in embedded systems, automotive, industrial, and medical applications, and is likely to be increasingly used in these areas. In addition, the model is also likely to be used in the development of intelligent robots, as its features and cost-effectiveness make it well-suited for this purpose.
The product description and specific design requirements of the XC2C256-6CP132C chip model are as follows. It is a 28 nm CMOS FPGA with a 256-bit configuration, and contains 6,132 logic cells. It has a total of 1,024 I/O pins, with a maximum speed of up to 300 MHz. It also has an integrated JTAG programming port, and a high-speed serial interface. In addition, the model also has a wide range of other features, such as an on-chip oscillator, memory, and programmable logic.
In order to ensure that the XC2C256-6CP132C chip model is used effectively, actual case studies and precautions should be taken into consideration. For example, the model should be tested and verified before use, to ensure that it meets the specific design requirements. In addition, the model should also be configured correctly, and the appropriate software should be used to program the model.
Finally, the question of whether the XC2C256-6CP132C chip model can be applied to the development and popularization of future intelligent robots should also be addressed. The answer is yes, as the model is well-suited for this purpose. In order to use the model effectively, however, certain technical talents are needed. These include knowledge of software engineering, hardware design, and embedded systems, as well as experience in programming and debugging FPGAs. With the right technical expertise, the XC2C256-6CP132C chip model can be used to develop and popularize future intelligent robots.
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5,601 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $27.0295 | $27.0295 |
| 10+ | $26.7389 | $267.3888 |
| 100+ | $25.2857 | $2,528.5680 |
| 1000+ | $23.8325 | $11,916.2400 |
| 10000+ | $21.7980 | $21,798.0000 |
| The price is for reference only, please refer to the actual quotation! | ||