
AMD Xilinx
XC2C128-6CP132C
XC2C128-6CP132C ECAD Model
XC2C128-6CP132C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1.8 V | |
Propagation Delay | 6 ns | |
Number of Inputs | 100 | |
Number of Outputs | 100 | |
Number of Macro Cells | 128 | |
Number of I/O Lines | 100 | |
Programmable Logic Type | FLASH PLD | |
Temperature Grade | COMMERCIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 0 DEDICATED INPUTS, 100 I/O | |
Additional Feature | YES | |
Architecture | PLA-TYPE | |
Clock Frequency-Max | 152 MHz | |
In-System Programmable | YES | |
JTAG BST | YES | |
Output Function | MACROCELL | |
Power Supplies | 1.5/3.3,1.8 V | |
Supply Voltage-Max | 1.9 V | |
Supply Voltage-Min | 1.7 V | |
JESD-30 Code | S-PBGA-B132 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 70 °C | |
Peak Reflow Temperature (Cel) | 240 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 132 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFBGA | |
Package Equivalence Code | BGA132,14X14,20 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 500 µm | |
Terminal Position | BOTTOM | |
Width | 8 mm | |
Length | 8 mm | |
Seated Height-Max | 1.1 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | 8 X 8 MM, 0.50 MM PITCH, CSP-132 | |
Pin Count | 132 | |
Reach Compliance Code | not_compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 |
XC2C128-6CP132C Datasheet Download
XC2C128-6CP132C Overview
The XC2C128-6CP132C chip model is an advanced integrated circuit (IC) designed by Xilinx. It is a low-power, high-performance, field-programmable gate array (FPGA) device, with a maximum operating frequency of up to 125 MHz. It is designed to provide a cost-effective solution for applications such as high-speed data acquisition, communications, and control systems.
The original design intention of the XC2C128-6CP132C chip model was to provide a powerful, low-power solution for applications that require high-speed data acquisition, communications, and control systems. It has been designed with the latest FPGA technology, providing enhanced performance and low power consumption. It is an ideal solution for applications in the industrial, automotive, and consumer sectors, as well as for applications in the medical and aerospace industries.
The XC2C128-6CP132C chip model can be used in advanced communication systems, as it is capable of providing high-speed data transfer and data processing. It can also be used in networks and intelligent scenarios, such as in the development and popularization of future intelligent robots. The chip model is also capable of being used in the era of fully intelligent systems, as it has the capability to process large amounts of data quickly and accurately.
In order to use the XC2C128-6CP132C chip model effectively, certain technical talents are required. These include knowledge of FPGA technology, programming languages such as Verilog and VHDL, as well as knowledge of embedded systems design. Additionally, knowledge of analog and digital circuit design, as well as an understanding of the principles of computer architecture and operating systems, are highly beneficial in order to effectively use the chip model.
In conclusion, the XC2C128-6CP132C chip model is an advanced integrated circuit designed by Xilinx. It is a powerful, low-power solution for applications that require high-speed data acquisition, communications, and control systems. It can be used in advanced communication systems, networks, and intelligent scenarios, as well as in the development and popularization of future intelligent robots. In order to use the chip model effectively, certain technical talents are required, such as knowledge of FPGA technology, programming languages, and embedded systems design.
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5,444 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $21.5587 | $21.5587 |
10+ | $21.3269 | $213.2689 |
100+ | $20.1678 | $2,016.7818 |
1000+ | $19.0087 | $9,504.3740 |
10000+ | $17.3861 | $17,386.0500 |
The price is for reference only, please refer to the actual quotation! |