
AMD Xilinx
XC2C128-4CP132C
XC2C128-4CP132C ECAD Model
XC2C128-4CP132C Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.8 V | |
Propagation Delay | 4.5 ns | |
Number of Macro Cells | 128 | |
Number of I/O Lines | 100 | |
Programmable Logic Type | FLASH PLD | |
Temperature Grade | COMMERCIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 0 DEDICATED INPUTS, 100 I/O | |
Additional Feature | YES | |
In-System Programmable | YES | |
JTAG BST | YES | |
Output Function | MACROCELL | |
Power Supplies | 1.5/3.3,1.8 V | |
Supply Voltage-Max | 1.9 V | |
Supply Voltage-Min | 1.7 V | |
JESD-30 Code | S-PBGA-B132 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 70 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 132 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFBGA | |
Package Equivalence Code | BGA132,14X14,20 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
Surface Mount | YES | |
Terminal Finish | Tin/Lead (Sn63Pb37) | |
Terminal Form | BALL | |
Terminal Pitch | 500 µm | |
Terminal Position | BOTTOM | |
Width | 8 mm | |
Length | 8 mm | |
Seated Height-Max | 1.1 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | 8 X 8 MM, 0.50 MM PITCH, CSP-132 | |
Pin Count | 132 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 |
XC2C128-4CP132C Datasheet Download
XC2C128-4CP132C Overview
The chip model XC2C128-4CP132C is a high-end model of FPGA (Field Programmable Gate Array) developed by Xilinx. It is suitable for high-performance digital signal processing, embedded processing, image processing, etc. It is based on the Virtex-2 architecture, and it requires the use of HDL (Hardware Description Language) for programming and design.
The XC2C128-4CP132C is a highly integrated chip model, which has a wide range of applications in various industries. It has a high performance and low power consumption, which makes it suitable for high-end applications. In addition, it also has a wide range of features, such as high-speed clock management, multi-channel DMA, and high-speed I/O.
As for the industry trends and future development of the chip model XC2C128-4CP132C, it is expected that the demand for FPGA will continue to increase in the future. With the development of new technologies, such as artificial intelligence, the application of FPGA will become more and more widespread. Therefore, the demand for XC2C128-4CP132C will also increase.
In terms of product description and design requirements, the XC2C128-4CP132C is an FPGA chip with a high integration level. It has a high performance and low power consumption, and it is suitable for high-end applications. In addition, it also has a wide range of features, such as high-speed clock management, multi-channel DMA, and high-speed I/O.
In terms of actual case studies and precautions, the XC2C128-4CP132C is a highly integrated chip model and it requires the use of HDL for programming and design. Therefore, it is important to understand the architecture and programming language of the chip model before starting the design. In addition, due to its high integration level, it is also important to pay attention to the details of the design, such as the timing constraints and power consumption.
In conclusion, the chip model XC2C128-4CP132C is a high-end model of FPGA developed by Xilinx. It is suitable for high-performance digital signal processing, embedded processing, image processing, etc. It has a high performance and low power consumption, and it requires the use of HDL for programming and design. With the development of new technologies, such as artificial intelligence, the demand for XC2C128-4CP132C will continue to increase in the future. Therefore, it is important to understand the architecture and programming language of the chip model, as well as the details of the design, such as the timing constraints and power consumption.
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