Intel Corporation
EPF10K50STC144-3
EPF10K50STC144-3 ECAD Model
EPF10K50STC144-3 Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 500 ps | |
| Number of Inputs | 102 | |
| Number of Outputs | 102 | |
| Number of Logic Cells | 2880 | |
| Number of I/O Lines | 102 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 102 I/O | |
| Output Function | MIXED | |
| Power Supplies | 2.5,2.5/3.3 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PQFP-G144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 220 | |
| Time@Peak Reflow Temperature-Max (s) | 20 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Equivalence Code | QFP144,.87SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 20 mm | |
| Length | 20 mm | |
| Seated Height-Max | 1.6 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Part Package Code | QFP | |
| Package Description | 22 X 22 MM, 0.50 MM PITCH, TQFP-144 | |
| Pin Count | 144 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
EPF10K50STC144-3 Overview
The chip model EPF10K50STC144-3 is a type of Field Programmable Gate Array (FPGA) developed by Altera Corporation. It is one of the most advanced FPGA products in the market, and it is widely used in various electronic systems and applications. The EPF10K50STC144-3 is a high-performance device that is capable of delivering powerful performance and enhanced system capabilities.
The EPF10K50STC144-3 is designed to meet the needs of a variety of applications, including consumer electronics, automotive, industrial, and aerospace. The chip model is highly efficient and cost-effective, and it is suitable for a variety of applications. It has a wide range of features, including a high-speed interface, on-chip memory, and a wide range of I/O ports.
In terms of industry trends, the EPF10K50STC144-3 is expected to continue to be a popular choice for many applications. It is also expected to be used in the development of new technologies and products, particularly in the field of robotics. The chip model is highly versatile and can be used to create powerful, reliable, and cost-effective solutions for a variety of applications.
In terms of the application environment, the EPF10K50STC144-3 is suitable for a wide range of applications, including consumer electronics, automotive, industrial, and aerospace. It is also suitable for the development of new technologies and products, particularly in the field of robotics. In order to use the chip model effectively, it is important to have a good understanding of the specific design requirements of the chip model and the actual case studies and precautions.
In terms of the development and popularization of future intelligent robots, the EPF10K50STC144-3 is expected to be an important component in the development of such robots. The chip model is highly versatile and can be used to create powerful, reliable, and cost-effective solutions for a variety of applications. In order to use the chip model effectively, it is important to have a good understanding of the specific design requirements of the chip model and the actual case studies and precautions. Technical talents such as engineers, technicians, and software developers are needed to use the chip model effectively.
Overall, the EPF10K50STC144-3 is a highly versatile chip model that is suitable for a wide range of applications. It is expected to be an important component in the development and popularization of future intelligent robots. In order to use the chip model effectively, it is important to have a good understanding of the specific design requirements of the chip model and the actual case studies and precautions. Technical talents such as engineers, technicians, and software developers are needed to use the chip model effectively.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||