Intel Corporation
EPF10K50ETI144-3
EPF10K50ETI144-3 ECAD Model
EPF10K50ETI144-3 Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 13.5 ns | |
| Number of Inputs | 102 | |
| Number of Outputs | 102 | |
| Number of Logic Cells | 2880 | |
| Number of I/O Lines | 102 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 102 I/O | |
| Output Function | MIXED | |
| Power Supplies | 2.5,2.5/3.3 V | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.3 V | |
| JESD-30 Code | S-PQFP-G144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 220 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Equivalence Code | QFP144,.63SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 20 mm | |
| Length | 20 mm | |
| Seated Height-Max | 1.6 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Part Package Code | QFP | |
| Package Description | LFQFP, QFP144,.63SQ,20 | |
| Pin Count | 144 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
EPF10K50ETI144-3 Overview
The EPF10K50ETI144-3 chip model is a highly advanced integrated circuit that is suitable for a wide range of high-performance digital signal processing, embedded processing, and image processing applications. This integrated circuit is designed to be programmed using a hardware description language (HDL). It is capable of performing a variety of complex tasks, such as data processing, data storage, and communication.
The EPF10K50ETI144-3 chip model has the potential to be used in a variety of intelligent scenarios, such as in networks and in the era of fully intelligent systems. For example, it can be used to develop artificial intelligence (AI) applications, including autonomous vehicles and robots. It can also be used in machine learning and natural language processing applications.
In terms of product design and implementation, the EPF10K50ETI144-3 chip model requires careful consideration of the design requirements. This includes the selection of the appropriate HDL language, the selection of the appropriate components and peripherals, as well as the appropriate layout and wiring of the board. Additionally, the chip model must be tested thoroughly to ensure that it meets all of the design requirements.
Case studies and examples of the successful implementation of the EPF10K50ETI144-3 chip model can be found online. These case studies provide insight into the design process and the challenges that may be encountered. Additionally, these studies provide valuable information about the precautions that must be taken when designing and implementing the chip model.
Overall, the EPF10K50ETI144-3 chip model is a powerful integrated circuit that is suitable for a wide range of high-performance digital signal processing, embedded processing, and image processing applications. With careful consideration of the design requirements, it can be successfully used in a variety of intelligent scenarios, such as in networks and in the era of fully intelligent systems. Additionally, case studies and examples of the successful implementation of the chip model can provide valuable insight into the design process and the precautions that must be taken.
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|---|---|---|
| No reference price found. | ||