Intel Corporation
EPF10K50ETC144-3
EPF10K50ETC144-3 ECAD Model
EPF10K50ETC144-3 Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 800 ps | |
| Number of Inputs | 102 | |
| Number of Outputs | 102 | |
| Number of Logic Cells | 2880 | |
| Number of I/O Lines | 102 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 102 I/O | |
| Additional Feature | 2880 LOGIC ELEMENTS | |
| Clock Frequency-Max | 140 MHz | |
| Output Function | MIXED | |
| Power Supplies | 2.5,2.5/3.3 V | |
| Supply Voltage-Max | 2.7 V | |
| Supply Voltage-Min | 2.3 V | |
| JESD-30 Code | S-PQFP-G144 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Peak Reflow Temperature (Cel) | 220 | |
| Time@Peak Reflow Temperature-Max (s) | 20 | |
| Number of Terminals | 144 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Equivalence Code | QFP144,.87SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 500 µm | |
| Terminal Position | QUAD | |
| Width | 20 mm | |
| Length | 20 mm | |
| Seated Height-Max | 1.6 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Part Package Code | QFP | |
| Package Description | 22 X 22 MM, 0.50 MM PITCH, TQFP-144 | |
| Pin Count | 144 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
EPF10K50ETC144-3 Overview
The chip model EPF10K50ETC144-3 is a powerful tool for digital signal processing, embedded processing, and image processing. It is designed to be used with hardware description language (HDL), allowing for the development of sophisticated applications. This chip model offers several advantages over its competitors, including a high clock speed, low power consumption, and the ability to handle a wide range of data types.
The EPF10K50ETC144-3 chip model is expected to be in high demand in the future, particularly in the fields of image processing, medical imaging, and artificial intelligence. Its high clock speed, low power consumption, and wide range of data types make it an ideal choice for these industries. It is also likely to be used in the development of advanced network applications and intelligent systems. The chip model is capable of handling complex data sets, making it a suitable choice for the era of fully intelligent systems.
The EPF10K50ETC144-3 chip model is a powerful tool that can be used in a variety of applications. Its high clock speed, low power consumption, and wide range of data types make it a suitable choice for image processing, medical imaging, artificial intelligence, and advanced network applications. Its capabilities make it an ideal choice for the era of fully intelligent systems, where it can be used to process complex data sets. As the demand for these applications continues to grow, the EPF10K50ETC144-3 chip model is expected to be in high demand in the future.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||