
Intel Corporation
EPF10K200SBC600-3
EPF10K200SBC600-3 ECAD Model
EPF10K200SBC600-3 Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 2.5 V | |
Propagation Delay | 800 ps | |
Number of Inputs | 470 | |
Number of Outputs | 470 | |
Number of Logic Cells | 9984 | |
Number of I/O Lines | 470 | |
Programmable Logic Type | LOADABLE PLD | |
Temperature Grade | COMMERCIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 470 I/O | |
Output Function | MIXED | |
Power Supplies | 2.5,2.5/3.3 V | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
JESD-30 Code | S-PBGA-B600 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 70 °C | |
Number of Terminals | 600 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA600,35X35,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 45 mm | |
Length | 45 mm | |
Seated Height-Max | 1.93 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | BGA, BGA600,35X35,50 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
ECCN Code | 3A991.D |
EPF10K200SBC600-3 Datasheet Download
EPF10K200SBC600-3 Overview
The EPF10K200SBC600-3 chip model is a high-performance digital signal processor that is designed to provide enhanced performance for embedded processing, image processing, and other digital signal processing tasks. It is designed to be used with the HDL language, which is a hardware description language used to describe the behavior of a digital system. This chip model is suitable for applications that require high performance and flexibility.
The original design intention of the EPF10K200SBC600-3 chip model was to provide a powerful and reliable digital signal processor that could be used in a variety of applications. It is capable of performing complex tasks quickly and efficiently, allowing users to create more complex applications and systems. The chip model is also designed to be easily upgradable, allowing users to add new features and capabilities to their systems.
The EPF10K200SBC600-3 chip model can be used for the development and popularization of future intelligent robots. The chip model is capable of performing complex tasks and processing data quickly and efficiently, making it an ideal choice for the development of robots. It is also capable of running advanced communication systems, allowing robots to interact with each other and with their environment.
In order to use the EPF10K200SBC600-3 chip model effectively, technical talents such as engineers and computer scientists are needed. Engineers must be able to design and program the chip model, while computer scientists must be able to analyze and interpret the data that the chip model produces. Additionally, the chip model can be used in combination with other technologies such as artificial intelligence and machine learning, allowing users to create more advanced robots.
You May Also Be Interested In
2,833 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $201.7058 | $201.7058 |
10+ | $199.5370 | $1,995.3696 |
100+ | $188.6926 | $18,869.2560 |
1000+ | $177.8482 | $88,924.0800 |
10000+ | $162.6660 | $162,666.0000 |
The price is for reference only, please refer to the actual quotation! |