
Intel Corporation
EPF10K200EBI600-2
EPF10K200EBI600-2 ECAD Model
EPF10K200EBI600-2 Attributes
Type | Description | Select |
---|---|---|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 2.5 V | |
Propagation Delay | 600 ps | |
Number of Inputs | 470 | |
Number of Outputs | 470 | |
Number of Logic Cells | 9984 | |
Number of I/O Lines | 470 | |
Programmable Logic Type | LOADABLE PLD | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 470 I/O | |
Additional Feature | 9984 LOGIC ELEMENTS | |
Clock Frequency-Max | 140 MHz | |
Output Function | MIXED | |
Power Supplies | 2.5,2.5/3.3 V | |
Supply Voltage-Max | 2.7 V | |
Supply Voltage-Min | 2.3 V | |
JESD-30 Code | S-PBGA-B600 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Number of Terminals | 600 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA600,35X35,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 45 mm | |
Length | 45 mm | |
Seated Height-Max | 1.93 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | BGA, BGA600,35X35,50 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
ECCN Code | 3A991.D |
EPF10K200EBI600-2 Datasheet Download
EPF10K200EBI600-2 Overview
The chip model EPF10K200EBI600-2 is a powerful integrated circuit that is designed to help drive advanced communication systems. It is a fully-programmable, high-speed, low-power solution that is capable of handling a variety of complex tasks. The chip is capable of performing a wide range of functions, from basic network communication to complex data processing and analysis.
The original design intention of the chip model EPF10K200EBI600-2 was to provide a reliable, low-power, high-performance solution for communication systems. It features an advanced architecture that is designed to optimize performance and reduce power consumption. The chip model also has a wide range of features, including multiple clock domains, multiple power domains, and advanced memory management. The chip model is also designed to be easily upgradeable and can be used in future networks and applications.
The chip model EPF10K200EBI600-2 is capable of being used in advanced communication systems, such as 5G networks. It can be used to provide reliable and secure communication between devices, as well as to process and analyze data. Additionally, the chip model can be used to develop intelligent applications, such as artificial intelligence and machine learning, which can be used to create powerful and efficient systems.
The product description and specific design requirements of the chip model EPF10K200EBI600-2 are detailed in the product documentation. The chip model is designed to be used in a wide variety of applications, including data processing, communication systems, and intelligent applications. The chip model is also designed to be highly reliable and secure, and is capable of handling a variety of tasks. Additionally, the chip model is designed to be easily upgradeable, allowing for future upgrades and improvements.
To ensure that the chip model EPF10K200EBI600-2 is used correctly, it is important to follow the product documentation and take the necessary precautions. Additionally, case studies and real-world applications of the chip model should be studied in order to understand how it can be used in different scenarios. This will allow for a better understanding of the chip model and its potential applications.
Overall, the chip model EPF10K200EBI600-2 is a powerful and reliable integrated circuit that is designed to drive advanced communication systems. It is capable of handling a variety of complex tasks, from basic network communication to complex data processing and analysis. The chip model is also designed to be easily upgradeable and can be used in future networks and applications. With the right precautions and case studies, the chip model can be used to create powerful and efficient systems in the era of fully intelligent systems.
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4,646 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $774.1468 | $774.1468 |
10+ | $765.8226 | $7,658.2263 |
100+ | $724.2018 | $72,420.1833 |
1000+ | $682.5810 | $341,290.5190 |
10000+ | $624.3119 | $624,311.9250 |
The price is for reference only, please refer to the actual quotation! |