EPF10K200EBI600-2
EPF10K200EBI600-2
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rohs

Intel Corporation

EPF10K200EBI600-2


EPF10K200EBI600-2
F18-EPF10K200EBI600-2
Active
LOADABLE PLD, 600 ps, CMOS, BGA, BGA600,35X35,50
BGA, BGA600,35X35,50

EPF10K200EBI600-2 ECAD Model


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EPF10K200EBI600-2 Attributes


Type Description Select
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 2.5 V
Propagation Delay 600 ps
Number of Inputs 470
Number of Outputs 470
Number of Logic Cells 9984
Number of I/O Lines 470
Programmable Logic Type LOADABLE PLD
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Technology CMOS
Organization 470 I/O
Additional Feature 9984 LOGIC ELEMENTS
Clock Frequency-Max 140 MHz
Output Function MIXED
Power Supplies 2.5,2.5/3.3 V
Supply Voltage-Max 2.7 V
Supply Voltage-Min 2.3 V
JESD-30 Code S-PBGA-B600
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Number of Terminals 600
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA600,35X35,50
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 45 mm
Length 45 mm
Seated Height-Max 1.93 mm
Ihs Manufacturer INTEL CORP
Package Description BGA, BGA600,35X35,50
Reach Compliance Code compliant
HTS Code 8542.39.00.01
ECCN Code 3A991.D

EPF10K200EBI600-2 Datasheet Download


EPF10K200EBI600-2 Overview



The chip model EPF10K200EBI600-2 is a powerful integrated circuit that is designed to help drive advanced communication systems. It is a fully-programmable, high-speed, low-power solution that is capable of handling a variety of complex tasks. The chip is capable of performing a wide range of functions, from basic network communication to complex data processing and analysis.


The original design intention of the chip model EPF10K200EBI600-2 was to provide a reliable, low-power, high-performance solution for communication systems. It features an advanced architecture that is designed to optimize performance and reduce power consumption. The chip model also has a wide range of features, including multiple clock domains, multiple power domains, and advanced memory management. The chip model is also designed to be easily upgradeable and can be used in future networks and applications.


The chip model EPF10K200EBI600-2 is capable of being used in advanced communication systems, such as 5G networks. It can be used to provide reliable and secure communication between devices, as well as to process and analyze data. Additionally, the chip model can be used to develop intelligent applications, such as artificial intelligence and machine learning, which can be used to create powerful and efficient systems.


The product description and specific design requirements of the chip model EPF10K200EBI600-2 are detailed in the product documentation. The chip model is designed to be used in a wide variety of applications, including data processing, communication systems, and intelligent applications. The chip model is also designed to be highly reliable and secure, and is capable of handling a variety of tasks. Additionally, the chip model is designed to be easily upgradeable, allowing for future upgrades and improvements.


To ensure that the chip model EPF10K200EBI600-2 is used correctly, it is important to follow the product documentation and take the necessary precautions. Additionally, case studies and real-world applications of the chip model should be studied in order to understand how it can be used in different scenarios. This will allow for a better understanding of the chip model and its potential applications.


Overall, the chip model EPF10K200EBI600-2 is a powerful and reliable integrated circuit that is designed to drive advanced communication systems. It is capable of handling a variety of complex tasks, from basic network communication to complex data processing and analysis. The chip model is also designed to be easily upgradeable and can be used in future networks and applications. With the right precautions and case studies, the chip model can be used to create powerful and efficient systems in the era of fully intelligent systems.



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Unit Price: $832.4159
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Pricing (USD)

QTY Unit Price Ext Price
1+ $774.1468 $774.1468
10+ $765.8226 $7,658.2263
100+ $724.2018 $72,420.1833
1000+ $682.5810 $341,290.5190
10000+ $624.3119 $624,311.9250
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