Intel Corporation
EPF10K200SBC600-1X
EPF10K200SBC600-1X ECAD Model
EPF10K200SBC600-1X Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Propagation Delay | 300 ps | |
| Number of Inputs | 470 | |
| Number of Outputs | 470 | |
| Number of Logic Cells | 9984 | |
| Number of I/O Lines | 470 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 470 I/O | |
| Output Function | MIXED | |
| Power Supplies | 2.5,2.5/3.3 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B600 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Number of Terminals | 600 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA600,35X35,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 45 mm | |
| Length | 45 mm | |
| Seated Height-Max | 1.93 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Package Description | BGA, BGA600,35X35,50 | |
| ECCN Code | 3A991.D |
EPF10K200SBC600-1X Datasheet Download
EPF10K200SBC600-1X Overview
The EPF10K200SBC600-1X chip model is a powerful digital signal processor and embedded processor, ideal for high-performance applications such as image processing. It requires the use of HDL language, making it a versatile yet complex tool.
The potential applications of this chip model in the future are vast, ranging from networks to intelligent scenarios. In the era of fully intelligent systems, the EPF10K200SBC600-1X can be used to develop and popularize future intelligent robots. This chip model has the potential to revolutionize the robotics industry, allowing for more complex and efficient robots.
Using this chip model effectively requires the right technical talent. Programmers and engineers with a good grasp of HDL language are needed to make the most out of this chip model. This chip model can be used to create robots with more advanced capabilities, such as better navigation and decision-making. It can also be used to create more efficient and powerful robots, allowing for more complex tasks to be completed.
In conclusion, the EPF10K200SBC600-1X chip model is a powerful tool for creating robots with advanced capabilities. It requires the use of HDL language, making it a complex but versatile tool. With the right technical talent, this chip model can be used to create robots with more advanced capabilities, allowing for the development and popularization of future intelligent robots.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||