Intel Corporation
EPF10K100ABC600-2
EPF10K100ABC600-2 ECAD Model
EPF10K100ABC600-2 Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 3.3 V | |
| Propagation Delay | 700 ps | |
| Number of Inputs | 406 | |
| Number of Outputs | 406 | |
| Number of Logic Cells | 4992 | |
| Number of Dedicated Inputs | 4 | |
| Number of I/O Lines | 406 | |
| Programmable Logic Type | LOADABLE PLD | |
| Temperature Grade | COMMERCIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 4 DEDICATED INPUTS, 406 I/O | |
| Output Function | REGISTERED | |
| Power Supplies | 2.5/3.3,3.3 V | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| JESD-30 Code | S-PBGA-B600 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 70 °C | |
| Number of Terminals | 600 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA600,35X35,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 45 mm | |
| Length | 45 mm | |
| Seated Height-Max | 1.93 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA600,35X35,50 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 |
EPF10K100ABC600-2 Datasheet Download
EPF10K100ABC600-2 Overview
The EPF10K100ABC600-2 chip model is a high-performance digital signal processing, embedded processing and image processing solution. It is designed to support the use of HDL language and has become a popular choice for many industries. This chip model has been widely adopted in various fields such as communications, medical, industrial automation, and consumer electronics.
The EPF10K100ABC600-2 chip model has been designed to be a versatile and reliable solution for a variety of applications. Its high-performance capabilities make it ideal for use in digital signal processing, embedded processing, and image processing. With its support for HDL language, it can be used to quickly and easily develop complex applications.
The EPF10K100ABC600-2 chip model is well-suited for use in networks and intelligent scenarios. It can be used in the era of fully intelligent systems, such as autonomous vehicles and smart homes. It is also capable of handling data from multiple sources, making it suitable for use in data-intensive applications.
The EPF10K100ABC600-2 chip model is a powerful and reliable solution for many industries. As technology advances, the chip model is likely to become even more powerful and capable of handling more complex tasks. As the industry trends shift, the chip model will be able to keep up with the changing needs of the market.
In the future, the EPF10K100ABC600-2 chip model will be used to develop more advanced applications. It will be able to support the use of new technologies, such as artificial intelligence, machine learning, and natural language processing. This chip model is well-suited for use in the era of fully intelligent systems and will be an integral part of the development of the Internet of Things.
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5,708 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $91.8840 | $91.8840 |
| 10+ | $90.8960 | $908.9600 |
| 100+ | $85.9560 | $8,595.6000 |
| 1000+ | $81.0160 | $40,508.0000 |
| 10000+ | $74.1000 | $74,100.0000 |
| The price is for reference only, please refer to the actual quotation! | ||